含苯并咪唑基耐高温聚酰亚胺胶粘剂的制备与性能研究  

Preparation and properties of high temperature resistant polyimide adhesive containing benzimidazole group

作　　者：祁浩然 杨明伟 杨洋 职欣心 张新岭 吴昊 张燕 刘金刚[1] Qi Haoran;Yang Mingwei;Yang Yang;Zhi Xinxin;Zhang Xinling;Wu Hao;Zhang Yan;Liu Jingang(School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;Composites Center of COM AC,Shanghai 201324,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院,北京100083 [2]中国商飞复合材料中心,上海201324

出　　处：《中国胶粘剂》2022年第5期7-12,共6页China Adhesives

基　　金：上海市自然科学基金项目(17ZR1411800);山东省重点研发计划项目(2019JZZY020235)。

摘　　要：采用含砜基二酐单体(4,4’-砜双邻苯二甲酸酐)与含苯并咪唑结构的二胺单体[2-(3-氨基苯基)-5-氨基苯并咪唑]以及芳香族二胺(4,4’-二氨基二苯醚)共聚制备了系列聚酰胺酸(PAA)胶粘剂。采用程序升温固化工艺(80~350℃)制备了相应系列的聚酰亚胺(PI)胶粘剂,并粘接不锈钢样片,对其性能进行了测试。研究结果表明:PAA胶粘剂具有较高的数均分子量,PI固化物具有良好的耐热性能,5%失重温度(T;)均超过500℃,玻璃化转变温度(T;)均超过320℃。PI胶粘剂常温粘接不锈钢单搭剪切强度(LSS)最高可达19.48 MPa,而250℃时的LSS值可保持初始值的77%以上。A series of polyamide acid(PAA) adhesive were prepared by copolymerization of sulfonecontaining dianhydride monomer (4,4’-sulfone diphthalic anhydride) and diamine monomer containing benzimidazole structure[2-(3-aminophenyl)-5-aminobenzimidazole]with aromatic diamine(4,4’-diaminodiphenyl ether).A series of polyimide(PI)adhesive were prepared by temperature programmed curing process(80-350℃),and they were bonded with stainless steel samples,and their properties were tested.The research results showed that PAA adhesive had high number average molecular weight,PI cured product had good heat resistance,the 5%weight loss temperature(T;)was more than 500℃,and the glass transition temperature(T;)was more than 320℃.The maximum single lap shear strength(LSS)of PI adhesive bonded with stainless steel at normal temperature could reach 19.48 MPa,while the LSS value at 250℃could maintain more than 77%of the initial value.

关 键 词：聚酰亚胺 胶粘剂 苯并咪唑 单搭剪切强度 热稳定性 

分 类 号：TQ430[化学工程]