墙壁开关银点接触压力与温升的关系研究  

Relationship Between Silver Point Contact Pressure and Temperature Rise of Wall Switch

作　　者：邱军 彭美南 

机构地区：[1]宁波公牛电器有限公司,慈溪315314

出　　处：《日用电器》2022年第6期37-41,共5页ELECTRICAL APPLIANCES

摘　　要：本文介绍了国家标准对墙壁开关温升的要求;理论分析开关中的电阻与温升的关系;通过试验,测出开关银点之间接触压力对温升的影响趋势,确定合理的墙壁开关银点接触压力设计范围,为后续墙壁开关产品设计提供建议和措施。This paper introduces the requirements of national standards for the temperature rise of wall switches;the relationship between resistance and temperature rise in the switch is analyzed theoretically;through the test,the influence trend of the contact pressure between the silver points of the switch on the temperature rise is measured,and the reasonable design range of the contact pressure of the silver points of the wall switch is determined,so as to provide suggestions and measures for the subsequent design of the wall switch products.

关 键 词：墙壁开关 银点接触压力 接触电阻 温升 

分 类 号：TM564[电气工程—电器]