苯基缩水甘油醚改性双氰胺环氧树脂固化剂的合成和性能研究  

The Synthesis and Performance Study on Phenyl Glycidyl Ether Modified Dicyandiamide Curing Agent for Epoxy Resin

作　　者：尚明屹 Shang Mingyi(School of Materials Science&Engineering Xiamen University of Technology,Xiamen 361024;College of Materials Xiamen University,Xiamen 361005,China)

机构地区：[1]厦门理工学院材料科学与工程学院,福建厦门361024 [2]厦门大学材料学院,福建厦门361005

出　　处：《广东化工》2022年第12期17-19,共3页Guangdong Chemical Industry

基　　金：福建省中青年教师教育科研项目(JAT210337)。

摘　　要：采用苯基缩水甘油醚对双氰胺进行改性,合成了一种新型的液化潜伏型环氧树脂固化剂,通过红外光谱测试分析了合成产物的化学结构,采用差示扫描量热仪、粘接强度测试对固化体系的性能进行了研究。结果表明,在环氧树脂E-51 100 phr,改性双氰胺30 phr的固化体系中加入0.5 phr的固化促进剂EMI后,DSC曲线中放热峰的峰顶温度降低到149.2℃,粘接强度提高到8.01 Mpa。这种改性双氰胺环氧树脂固化剂具有良好的固化性能,反应活性较高,而且与环氧树脂的相溶性良好,具有较高的粘接强度,有一定的电子工业应用前景。A new kind of liquide latent curing agent for epoxy resin was synthesized by using phenyl glycidyl ether modified dicyandiamide,the chemical construction of modified dicyandiamide was characterized by using FTIR,then bonding strength of the curing system were measured and DSC was used to investigate the property of cured product.The results suggested that in a curing system with 100 phr epoxy resin E-51,30 phr modified dicyandiamide and 0.5 phr EMI as promotor,the peak temperature at DSC curve of the curing system reduced to 149.2 ℃ and bonding strength of the curing system increased to 8.01 MPa.The phenyl glycidyl ether modified dicyandiamide curing agent for epoxy resin had better performance and reactivity.Furthermore,the curing agent had favourable solubility in epoxy resin and higher bonding strength so that could be used in electronic industry.

关 键 词：环氧树脂 苯基缩水甘油醚 双氰胺 潜伏型固化剂 粘结强度 

分 类 号：TQ[化学工程]