Achieving Reliable CoSb_(3) based thermoelectric joints with low contact resistivity using a high-entropy alloy diffusion barrier layer  

作　　者：Z.Sun X.Chen Juncheng Zhang Huiyuan Geng L.X.Zhang 

机构地区：[1]State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin,150001,China

出　　处：《Journal of Materiomics》2022年第4期882-892,共11页无机材料学学报（英文）

基　　金：The authors gratefully acknowledge National Natural Science Foundation of China[Grant No.51805113 and 51775142];National Key R&D Program of China[2019YFA0705201];China Postdoctoral Science Foundation funded project[Grant No.2020T130143,2018M631923];Fundamental Research Funds for the Central Uni-versities[Grant No.FRFCU5710050920];Heilongjiang Touyan Team[XNAUEA 5640202520]。

摘　　要：Skutterudite(SKD)thermoelectric materials have high conversion efficiency,great mechanical proper-ties,and economical practicability in the medium temperature range(500e550C).They need to bejoined with metal electrodes to form a thermoelectric power generation device during application.However,high contact resistivity,severe element diffusion,and large coefficient of thermal expansionmismatch are main obstacles for their applications.To address these issues,a FeCoNiCrMo high-entropyalloy diffusion barrier layer was designed and prepared using an arc smelting method in this paper.Effectof heating temperatures on the microstructure and properties of the bonded joints were investigated.The maximum shear strength was 21.6 Mpa and the corresponding reaction layer thickness,contactresistivity were 3.77 mm,1.8 mUcm2 respectively at 600C,40 MPa,10 min.Shear strength dropped downto 18.8 MPa and the contact resistivity increased to 4.2 mU cm2 after aging for 640 h.Numerical modelwas established and it predicted that the contact resistivity would keep lower than 6.5 mU cm2(300 h,100 days)and 11 mU cm2(8760 h,1 year)and the reaction layer thickness would not exceed 25 mm(2400 h,100 days)and 45 mm(8760 h,1 year).

关 键 词：High-entropy diffusion barrier layer SKUTTERUDITE Diffusion bonding Microstructure Shear strength Contact resistivity 

分 类 号：TG13[一般工业技术—材料科学与工程]