环氧复合体系的增韧及其固化动力学研究  

Study on toughening and curing kinetics of epoxy composite system

作　　者：邓超 吴战武 李琳 崔玉涛 白永平 Deng Chao;Wu Zhanwu;Li Lin;Cui Yutao;Bai Yongping(School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin 150006,Heilongjiang,China;Wuxi Fuyue Bangwei New Material Co.,Ltd.,Wuxi 214100,Jiangsu,China;Shanghai Space Propulsion Technology Research Institute,Shanghai 201100,China;Wuxi HIT New Material Research Institute Co.,Ltd.,Wuxi 214100,Jiangsu,China)

机构地区：[1]哈尔滨工业大学化工与化学学院,黑龙江哈尔滨150006 [2]无锡氟越邦维新材料有限公司,江苏无锡214100 [3]上海航天动力技术研究所,上海201100 [4]无锡海特新材料研究院有限公司,江苏无锡214100

出　　处：《中国胶粘剂》2022年第3期1-6,共6页China Adhesives

摘　　要：采用超支化环氧树脂(HBEP)对环氧复合体系(NPEL-127/NPPN-631/TMPMP)进行增韧改性,并采用非等温差示扫描量热分析(DSC)法研究了HBEP对环氧体系固化反应动力学的影响。此外,采用T-β外推法,确定了HBEP增韧环氧体系的固化温度。选用Kinetics Neo分析软件中的几种动力学方法进行建模,得到固化反应参数。然后进行不同温度下的等温固化反应预测,并结合实际固化时间和固化程度测试,对比分析了模型及非模型方法描述固化行为的适应性。研究结果表明:当w(HBEP)=10%时,固化反应的起始温度提前了10℃左右,并降低了固化体系的焓变值。与传统的模型拟合法相比,非模型动力学中的Numerical法能够更精准地预测本体系的固化反应历程。通过Numerical法来模拟HBEP增韧环氧体系在等温固化和分步固化两种工艺下的固化度,进而确定了该反应的最佳固化工艺为100~130℃/60 min+130℃/40 min+130~200℃/14 min,为优化环氧胶粘剂配方和固化工艺提供了理论依据。The epoxy composite system(NPEL-127/NPPN-631/TMPMP)was toughened by hyperbranched epoxy resin(HBEP),and the effects of HBEP on curing reaction kinetics of epoxy system were studied by nonisothermal differential scanning calorimetry(DSC)method.In addition,the curing temperature of HBEP toughened epoxy system was determined by T-βextrapolation method.Several kinetics methods in Kinetics Neo analysis software were selected for modeling,and the curing reaction parameters were obtained.Then,isothermal curing reaction was predicted at different temperatures,and combining with the actual curing time and curing degree test,the adaptability of model and non-model methods to describe the curing behavior was compared and analyzed.The research results showed that when w(HBEP)=10%,the initial temperature of curing reaction was advanced by about 10℃,and the enthalpy change of curing system was reduced.Compared with the traditional model fitting method,the Numerical method in non-model kinetics could predict the curing reaction process of the system more accurately.Numerical method was used to simulate the curing degree of HBEP toughened epoxy system under two processes of isothermal curing and step curing,and the optimal curing process of the reaction was determined as100-130℃/60 min+130℃/40 min+130-200℃/14 min,which provided a theoretical basis for optimizing the formulation and curing process of epoxy adhesive.

关 键 词：超支化环氧树脂 环氧树脂增韧 非等温DSC法 Kinetics Neo分析软件 固化反应动力学 固化工艺 

分 类 号：TQ433.4[化学工程]