ChCl-Urea低共熔溶剂中Ni-P合金的电沉积行为研究  

Preparation and Electrochemical Behavior of Ni-P Alloy Coating in Ch Cl-Urea Deep Eutectic Solvent

作　　者：崔琳琳 王贺 崔家宁 张春霞 战充波 孙海静 周欣 孙杰[1] CUI Linlin;WANG He;CUI Jianing;ZHANG Chunxia;ZHAN Chongbo;SUN Haijing;ZHOU Xin;SUN Jie(Shenyang Ligong University,Shenyang,110159,China)

机构地区：[1]沈阳理工大学环境与化学工程学院,沈阳110159

出　　处：《沈阳理工大学学报》2022年第4期62-67,共6页Journal of Shenyang Ligong University

基　　金：辽宁省教育厅青年科技人才"育苗"项目(LG201928);辽宁省-沈阳材料科学国家研究中心联合研发基金项目(2019JH3/30100021)。

摘　　要：以氯化胆碱-尿素(ChCl-Urea)低共熔溶剂为基础液,电沉积制备Ni-P合金镀层。采用循环伏安和计时电流技术对Ni-P合金镀层的电沉积机理进行研究,使用扫描电子显微镜(SEM/EDS)和X射线衍射(XRD)对镀层的微观形貌、元素组成和物相组成进行表征,利用动电位极化曲线对镀层的耐腐蚀性能进行分析。结果表明,Ni-P合金镀层在ChCl-Urea-NiCl_(2)-NaH_(2)PO_(2)低共熔溶剂中的电沉积过程是受扩散步骤控制的不可逆过程,且成核机理为三维连续成核,该体系下可制得光亮、平滑、致密的镀层。Ni-P alloy coating was prepared by electrodeposition with ChCl-Urea,a deep eutectic solvent as base solution.The electrodeposition mechanism of Ni-P alloy coating was studied by cyclic voltammetry and timing current technique.The microstructure,el-emental composition and phase composition of the coating were characterized by scan-ning electron microscopy(SEM/EDS)and X-ray diffraction(XRD).The corrosion re-sistance of the coating was studied by potentiodynamic polarization curve.The results show that the electrodeposition process of Ni-P alloy coating in ChCl-Urea-NiCl_(2)-NaH_(2)PO_(2) deep eutectic solvent is an irreversible process controlled by diffusion steps and the nucleation mechanism is three-dimensional continuous nucleation.Bright,smooth and compact coating can be obtained in this system.

关 键 词：低共熔溶剂 镍磷合金 电沉积 耐腐蚀性 

分 类 号：TQ153.16[化学工程—电化学工业]