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作 者:舒林 Shu Lin(Zhuhai Master Intelligent Equipment Co.,Ltd.,Guangdong,519000)
机构地区:[1]珠海市玛斯特智能装备有限公司,广东519000
出 处:《当代化工研究》2022年第14期24-26,共3页Modern Chemical Research
摘 要:本文在热电模块表面形成化学镀Ni-P层作为扩散阻挡层,以考察Ni-P化学镀层对钎焊层与热电模块之间结合强度的增强作用。研究结果表明,通过化学镀Ni-P和Ag基钎焊制造的PbTe热电模块的结合强度高达约8.3MPa,而未化学镀Ni-P的PbTe热电模组的结合强度较低,只有约为3.6MPa,化学镀的应用明显提高了热电模块的结合强度。同时,在热电元件和钎焊层之间的结合界面处没有观察到诸如气孔或裂纹等缺陷。In this paper,electroless Ni-P coating was formed on the surface of thermoelectric module as diffusion barrier to investigate the enhancement of bonding strength between the brazing layer and thermoelectric module.The results show that the bonding strength of PbTe thermoelectric module manufactured by electroless Ni-P and Ag-based brazing is as high as 8.3MPa,while that of PbTe thermoelectric module without electroless Ni-P is only 3.6 MPa.The application of electroless plating obviously improves the bonding strength of the thermoelectric module.At the same time,no defects such as pores or cracks were observed at the bonding interface between the thermoelectric element and the brazing layer.
分 类 号:TG178[金属学及工艺—金属表面处理] TG454[金属学及工艺—金属学]
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