高频柔性覆铜板用聚酰亚胺与液晶高分子改性研究进展  

Research Progress on Modification of Polyimide and Liquid Crystal Polymer for High Frequency Flexible Copper Clad Laminates

作　　者：张希 彭忠泉 张文祥 刘述梅[1] 赵建青[1] 张世杰 ZHANG Xi;PENG Zhongquan;ZHANG Wenxiang;LIU Shumei;ZHAO Jianqing;ZHANG Shijie(School of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China;Kingfa Sci.and Tech.Co.,Ltd.,Guangzhou 510663,China;School of Materials Science and Engineering,Guangdong University of Petrochemical Technology,Maoming 525000,China)

机构地区：[1]华南理工大学材料科学与工程学院,广东广州510640 [2]金发科技股份有限公司,广东广州510663 [3]广东石油化工学院材料科学与工程学院,广东茂名525000

出　　处：《塑料工业》2022年第7期26-31,共6页China Plastics Industry

基　　金：2019年度广东省重点领域研发计划“5G通信关键材料及应用”重点专项项目(2020B010179001);广东省高性能与功能高分子材料重点实验室开放课题基金资助(20190018)。

摘　　要：5G通信用高频柔性覆铜板(FCCL)的层间介质材料主要是聚酰亚胺(PI)和液晶高分子(LCP)薄膜,应用在5G通信领域时,PI较大的介电常数与介电损耗,会引起严重的信号损耗,通常采用引入多孔结构、大体积单元和低极化率基团等手段进行改性。LCP的介电性能明显优于PI薄膜,目前,对LCP的研究主要集中在其与铜箔的附着力差和柔韧性方面。本文重点介绍了FCCL用PI低介电改性和LCP表面改性方面的研究进展,并对高频下低介电高分子材料未来发展趋势进行展望。The interlayer dielectric materials of 5 G flexible copper clad laminates(FCCL)for communication mainly contained polyimide(PI)and liquid crystal polymer(LCP)thin films.PI thin films had a large dielectric constant and dielectric loss,which could cause serious signal loss.In order to improve dielectric properties,PI was usually modified by introducing porous structure,large volume units and low polarizability groups.The dielectric properties of LCP thin films at high frequency were obviously better than PI.At present,the research on LCP mainly focused on its poor adhesion with copper foil and flexibility.In this review,comments were made on research progress in the low dielectric modification of PI and surface modification of LCP for FCCL,and the future development trend of low dielectric polymer materials at high frequency were pointed out.

关 键 词：聚酰亚胺 液晶高分子 介电性能 柔性覆铜板 改性 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]