Cu含量对黄铜接线端子组织和性能的影响  

The influence of Cu content on the structure and performance of brass terminal

作　　者：易轶杰 王振生 谢亿 李海星 刘维可 王凤祥 YI Yijie;WANG Zhensheng;XIE Yi;LI Haixing;LIU Weike;WANG Fengxiang(Key Laboratory of Mechanical Equipment Health Maintenance of Hunan University of Science and Technology,Xiangtan 411201,China;State Grid Hunan Electric Power Corporation Research Institute,Changsha 410007,China;Hunan Guosheng New Material Technology Co.,Ltd.,Xiangtan 411199,China)

机构地区：[1]湖南科技大学机械设备健康维护重点实验室,湖南湘潭411201 [2]国网湖南电力有限公司电力科学研究院,长沙410007 [3]湖南国生新材料科技有限公司,湖南湘潭411199

出　　处：《重庆理工大学学报（自然科学）》2022年第7期148-154,共7页Journal of Chongqing University of Technology：Natural Science

基　　金：湖南省自然科学基金项目(2020JJ4312)。

摘　　要：通过对4种不同Cu含量的黄铜接线端子的组织及其性能评价,研究了Cu含量与黄铜接线端子组织、力学性能、氨熏腐蚀性能和导电性能之间的关系。研究结果表明:Cu质量分数59%的H59合金由(Cu,Zn)相、Cu_(5)Zn_(8)相和CuZn相组成,Cu质量分数70%的H70合金由(Cu,Zn)相与树枝晶状的Cu_(0.64)Zn_(0.36)相组成,质量分数大于80%的H80合金和H90合金,即随着Cu含量增多,黄铜组织中的CuZn金属间化合物逐渐减少,(Cu,Zn)相逐渐增多。随着Cu含量增多,黄铜强度降低,导电率升高,抗应力腐蚀能力增强。无应力和压应力的氨熏工况下,黄铜接线端子均不产生裂纹。拉应力的氨熏工况下,Cu含量小于质量分数80%的黄铜合金中(Cu,Zn)/金属间化合物界面产生的微孔是导致裂纹的主要原因,表面镀锡不能完全抑制裂纹的产生。Cu质量分数90%的H90合金作为接线端子材质具有良好的应用可靠性。Through the evaluation of the structure and performance of four brass terminals with different Cu content,the relationship between the Cu content and the structure,mechanical properties,ammonia fumigation corrosion performance and electrical conductivity of the brass terminals is studied.The research results show that the H59 alloy whose Cu content is 59 wt.%consists of(Cu,Zn)phase,Cu_(5)Zn_(8)phase and CuZn phase,the H70 alloy whose Cu content is 70 wt.%consists of the(Cu,Zn)phase and dendritic Cu_(0.64)Zn_(0.36)phase composition,the H80 alloy and the H90 alloy whose Cu content higher than 80 wt.%are both(Cu,Zn)phases,in other words,with the increasement of Cu content,the Cu-Zn intermetallic compounds in the brass structure gradually decrease,(Cu,Zn)phases gradually increased.With the increasement of Cu content,the strength of the brass decreases,the conductivity increases,and the stress corrosion resistance increases.There is not cracks produced in the brass terminals under the ammonia fumigation conditions without stress and compressive stress.Under the condition of ammonia fumigation with tensile stress,the micropores produced at the(Cu,Zn)/intermetallic compound interface in brass alloys with a Cu content of less than 80 wt.%are the main cause of cracks,and tin plating on the surface cannot completely inhibit the cracks.produce.H90 alloy with 90 wt.%Cu content as a terminal material has good application reliability.

关 键 词：黄铜合金 接线端子 微观组织 应力腐蚀 导电率 

分 类 号：TM207[一般工业技术—材料科学与工程]