松香含量对焊锡膏焊后残留及润湿性能的影响  

Effect of rosin content on the residue after welding and wettability of solder paste

作　　者：许国栋 闫焉服[1] 高婷婷 李永康 XU Guodong;YAN Yanfu;GAO Tingting;LI Yongkang(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471000,Henan pro.,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023

出　　处：《焊接技术》2022年第6期70-74,I0008,共6页Welding Technology

基　　金：国家自然科学基金资助项目(5117151);河南省杰出青年基金资助项目(144100510002)。

摘　　要：松香具有良好的活性和成膜性,能够改善焊锡膏的润湿性,但焊后残留难以清洗。为了保证焊锡膏具有良好润湿性的同时达到免清洗的效果,文中开发了一种SAC305焊锡粉用免清洗助钎剂,研究了不同松香含量助钎剂对SAC305焊锡膏焊后残留物含量及润湿性能的影响。结果表明:当助钎剂中w(松香)在5%~20%时,随着w(松香)的增加,铺展面积和铺展率呈先增后减的趋势;当w(松香)10%时,铺展面积和铺展率最大,为143 mm和88.6%,焊点成形性良好,钎焊接头界面组织均匀,且焊后母材能达到免清洗的效果。Rosin had good activity and film-forming property,which could improve the wettability of solder paste,but the residue after welding was difficult to clean.In order to ensure the solder paste had good wettability and achieved the effect of no-clean at the same time,a no-clean flux for SAC305 solder powder was developed in this paper.The effects of flux with different rosin content on the residue content after welding and wettability of SAC305 solder paste were studied.The results showed that when the total mass fraction of rosin in flux was 5%~20%,the spreading area and spreading rate increased first and then decreased with the increase of rosin content.When the mass fraction of rosin was10%,the spreading area and spreading rate were the largest,which were 143 mm~2 and 88.6%.The formability of solder joint was well,the interface structure of brazed joint was uniform,and the parent material could achieve the effect of no-clean after welding.

关 键 词：免清洗助焊剂 SAC305焊锡膏 松香含量 焊后残留 润湿性 

分 类 号：TG425[金属学及工艺—焊接]