Simulating the stress–strain state of a thin plate after a thermal shock  

作　　者：A.V.Sedelnikov S.V.Glushkov V.V.Serdakova M.A.Evtushenko E.S.Khnyryova 

机构地区：[1]Samara National Research University 34,Moskovskoye Shosse,Samara 443086 Samarskaya Oblast,Russia [2]Amur State University,21,Ignat’yevskoye Shosse Blagoveshchensk 675027,Amurskaya Oblast,Russia

出　　处：《International Journal of Modeling, Simulation, and Scientific Computing》2022年第3期245-254,共10页建模、仿真和科学计算国际期刊（英文）

基　　金：This work is supported by the Ministry of Education and Science of the Russian Federation in the framework of the State Assignments to Higher Education Institutions and Research Organizations in the Field of Scientific Activity(Project FSSS-2020-0017).

摘　　要：The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package.The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined.The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.

关 键 词：Thermal shock thin plate stress-strain state temperature field 

分 类 号：TG1[金属学及工艺—金属学]