基于氢化均酐的浅色PI模压片制备与性能  

Preparation and Properties of Light-Colored PI Molding Sheets based on Hydrogenated Pyromellitic Anhydrides

作　　者：任茜 王学伟 职欣心 王振中 杨昶旭 王晓蕾 戴昇伟 刘金刚[1] Ren Xi;Wang Xuewei;Zhi Xinxin;Wang Zhenzhong;Yang Changxu;Wang Xiaolei;Dai Shengwei;Liu Jingang(School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;RAYITEK Hi-Tech Film Company,Co.,Ltd.,Shenzhen 518105,China;Weihai Newera Kesense New Materials Co.,Ltd.,Weihai 264200,China)

机构地区：[1]中国地质大学(北京)材料科学与工程学院,北京100083 [2]深圳瑞华泰薄膜科技股份有限公司,广东深圳518105 [3]威海新元科盛新材料有限公司,山东威海264200

出　　处：《工程塑料应用》2022年第8期7-16,共10页Engineering Plastics Application

基　　金：深圳市科技计划项目(JSGG20210629144539012);山东省重点研发计划重大科技创新工程项目(2019JZZY020235)。

摘　　要：采用脂环二酐,1S,2R,4S,5R-氢化均苯四甲酸二酐(ccHPMDA,Ⅰ)或1R,2S,4S,5R-氢化均苯四甲酸二酐(ctHPMDA,Ⅱ)分别与芳香族二胺,1,3-双(3-胺基苯氧基)苯(133APB,a)或1,3-双(4-胺基苯氧基)苯(134APB,b)通过高温溶液缩聚法制备了4种半脂环结构聚酰亚胺(PI)树脂PI-Ⅰa,PI-Ⅰb,PI-Ⅱa以及PI-Ⅱb。结果表明,半脂环结构赋予了这类PI材料良好的热塑性与热熔加工特性。采用上述PI树脂通过模压工艺成功制备了4种厚度约为3 mm的PI模压片。该系列模压片在760 nm波长处的透光率最高可达51.7%,显著优于现有商业化热塑性PI(TPI)模压片。此外,该系列PI模压片表现出了良好的耐热稳定性,玻璃化转变温度均大于200℃,在氮气中的5%失重温度(T_(5%))大于490℃。力学性能测试结果显示,该系列PI模压片具有良好的拉伸、弯曲、压缩性能。PI-Ⅱb模压片的弯曲强度与弯曲弹性模量分别为(181.8±3.9)MPa和(4.08±0.07)GPa;压缩强度与压缩弹性模量分别为(154.0±2.9)MPa和(1.64±0.35)GPa;拉伸强度与断裂伸长率分别为(138.5±0.6)MPa与(17.4±1.2)%。Four semi-alicyclic polyimide(PI)resins,including PI-Ⅰa(ccHPMDA-133APB),PI-Ⅰb,PI-Ⅱa,and PI-Ⅱb were prepared from two alicyclic dianhydrides,1S,2R,4S,5R-hydrogenated pyromellitic dianhydride(ccHPMDA,I),1R,2S,4S,5R-hydrogenated pyromellitic dianhydride and two aromatic diamines,1,3-bis(3-aminophenoxy)benzene(133APB,a)and 1,3-bis(4-aminophenoxy)benzene(134APB,b),respectively via a one-step high-temperature polycondensation procedure.The results show that the semi-alicyclic molecular structures endow the derived PI resins good thermoplasticity and melting processability.PI molding sheets with the thickness around 3 mm are successfully prepared via a high-temperature molding procedure with the developed PI resins.The PI sheets show the optical transmittance values up to 51.7%at the wavelength of 760 nm,which are obviously higher than those of the currently commercially available thermoplastic PI(TPI)molding sheets.The PI sheets show good thermal stabilities with the glass transition temperatures higher than 200℃and the 5%weight loss temperatures higher than 490℃in nitrogen.The PI sheets exhibit good tensile,flexural and compressive properties according to the mechanical measurements.For example,the PI-Ⅱb molding sheets exhibite the flexural strength and modulus of(181.8±3.9)MPa and(4.08±0.07)GPa,respectively;the compressive strength and modulus of(154.0±2.9)MPa and(1.64±0.35)GPa,respectively;and the tensile strength and elonga-tions at breaks of(138.5±0.6)MPa and(17.4±1.2)%,respectively.

关 键 词：热塑性聚酰亚胺 浅色 模压片 光学性能 力学性能 

分 类 号：TM215.1[一般工业技术—材料科学与工程]