基于Icepak的电网保护装置热设计研究  

Thermal Analysis of Power Gird Protection Device Based on Icepak

作　　者：周辉 郑立亮[1,2] 沈敏 夏雨[1,2] 甘云华 周华良 王新春[1,2] ZHOU Hui;ZHENG Liliang;SHEN Min;XIA Yu;GAN Yunhua;ZHOU Hualiang;WANG Xinchun(NARI Group Corporation State Grid Electric Power Research Institute,Nanjing 211106,China;NARI Technology Co.,Ltd.,Nanjing 211106,China;State Key Laboratory of Smart Grid Protection and Control,Nanjing 211106,China)

机构地区：[1]南瑞集团(国网电力科学研究院)有限公司,江苏南京211106 [2]国电南瑞科技股份有限公司,江苏南京211106 [3]智能电网保护与运行控制国家重点实验室,江苏南京211106

出　　处：《机械制造与自动化》2022年第4期206-210,共5页Machine Building & Automation

基　　金：国家电网公司总部科技项目资助(5700-202040263A-0-0-00)。

摘　　要：以某电网保护装置为热设计研究对象,针对国产CPU、FPGA芯片在70℃环境温度运行时超过其最高许用温度的问题,先通过理论模型计算选定自然散热的冷却方式,再利用Icepak仿真软件分析装置内部稳态温度分布情况。通过调整高功耗插件的间隔距离、增加独立风道结构等措施,实现装置内部关键芯片的控温要求,提升了设备可靠性,并在温度实验中得到验证。With the power grid protection device taken as the thermal design research object and aimed at the problem that domestic CPU and FPGA chips exceed their maximum allowable temperature when running at an ambient temperature of 70℃,a natural cooling method is initially selected based on theoretical model calculations,and the internal steady-state temperature distribution of the device is analyzed by the Icepak simulation software.The temperature control requirements for critical chips are achieved by adjusting the spacing distance of high-power plug-in modules and adding independent air duct structures,etc.,which improves the reliability of the device and is verified by thermal experiments.

关 键 词：电网保护装置 热设计 Icepak 数值模拟 

分 类 号：TK123[动力工程及工程热物理—工程热物理]