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作 者:Juan Fang Yunfei Mao Min Cai Li’ang Zhao Huijie Chen Wei Xiang
机构地区:[1]Faculty of Information Technology,Beijing University of Technology,Beijing,100124,China [2]La Trobe University,Melbourne,VIC 3086,Australia [3]James Cook University,Cains,QLD 4878,Australia
出 处:《Computers, Materials & Continua》2022年第9期5531-5545,共15页计算机、材料和连续体(英文)
基 金:The work of BJUT researchers Fang et al.was partly supported by the Beijing Natural Science Foundation(4192007);the National Natural Science Foundation of China(61202076);Beijing University of Technology Project No.2021C02.
摘 要:Since the three-dimensional Network on Chip(3D NoC)uses through-silicon via technology to connect the chips,each silicon layer is conducted through heterogeneous thermal,and 3D NoC system suffers from thermal problems.To alleviate the seriousness of the thermal problem,the distribution of data packets usually relies on traffic information or historical temperature information.However,thermal problems in 3D NoC cannot be solved only based on traffic or temperature information.Therefore,we propose a Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)that applies traffic load and temperature information to routing.First,the STTAR dynamically adjusts the input and output buffer lengths of each router with traffic load information to limit routing resources in overheated areas and control the rate of temperature rise.Second,STTAR adopts a scoring strategy based on temperature and the number of free slots in the buffer to avoid data packets being transmitted to high-temperature areas and congested areas and to improve the rationality of selecting routing output nodes.In our experiments,the proposed scoring Score-Based Traffic-and Thermal-Aware Adaptive Routing(STTAR)scheme can increase the throughput by about 14.98%to 47.90%and reduce the delay by about 10.80%to 35.36%compared with the previous works.
关 键 词:Buffer allocation THERMAL 3D NoC routing algorithm
分 类 号:TP393[自动化与计算机技术—计算机应用技术]
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