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作 者:刘海红 秦经刚 金环 肖冠宇 王东虎 Liu Haihong;Qin Jinggang;Jin Huan;Xiao Guanyu;Wang Donghu(Institute of Plasma Physics,CAS,Hefei 230031,China;University of Science and Technology of China,Hefei 230036,China)
机构地区:[1]中国科学院等离子体物理研究所,合肥230031 [2]中国科学技术大学,合肥230026
出 处:《低温与超导》2022年第7期11-16,共6页Cryogenics and Superconductivity
基 金:国家重点研发计划(2019YFC0117502);中国科学院战略性先导科技专项(XDB25000000);中国科学院科研仪器设备研制项目(YJKYYQ20190013)资助。
摘 要:焊接工艺作为制作电流均匀分布、性能良好的YBCO CICC导体接头端子的关键性技术之一,是保证YBCO CICC导体在低温、高场下长时间稳定运行的重要因素。主要介绍了用焊料填充法制作YBCO CICC导体接头端子的焊接工艺,焊料填充法选取的焊料熔融温度为145℃,其主要成分为Pb32Sn50Sb0.1。端子制作时加热温度保持180℃恒温,加热时间5 min。为验证该焊接工艺对导体载流性能的影响及工艺可靠性,截取了距离导体接头端部每层长为150 mm的YBCO带材,并在77 K条件下对每层带材的临界电流进行了测试。测试结果表明,导体接头端部带材临界电流均保持在168±15 A以内,载流性能未衰退。得出焊料填充法焊接工艺对导体端部性能没有影响,工艺可靠性高,满足实验需求。焊料填充法焊接工艺可以为YBCO CICC导体的制备及应用于未来大型聚变装置提供关键技术支持。The welding process is one of the key technologies for making connector terminals of YBCO CICC conductors with uniform current distribution and good performance. It is also an important factor to ensure the long-term stable operation of YBCO CICC conductors at low temperatures and high fields. The soldering process for making YBCO CICC conductor connector terminals was described by the solder filling method. To verify the influence of the welding process on the conductor current-carrying performance and process reliability, a 150 mm long YBCO tape of each layer was intercepted from the end of the conductor connector, and the critical current of each layer was tested at 77 K. Test results show that the critical current of the tape at the end of the conductor’s joint is maintained within 168±15 A, with no degradation in current-carrying performance. The solder filling method for the welding process has no effect on the conductor end performance, the process is reliable and meets the experimental needs. The solder-filled welding process can provide key technical support for the preparation of YBCO CICC conductors and their application in future large-scale fusion devices.
关 键 词:YBCO CICC导体 接头端子 焊接工艺 临界电流
分 类 号:TL622[核科学技术—核技术及应用]
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