温度校准和温度平衡罩对DMA测试基材T_(g)的影响  

Influence of temperature calibration and temperature equilibration hood on T_(g) testing of base material by DMA

作　　者：刘文龙[1] 任科秘 杨杰 Liu Wenlong;Ren Kemi;Yang Jie

机构地区：[1]广东生益科技股份有限公司,东莞523808

出　　处：《印制电路信息》2022年第8期19-23,共5页Printed Circuit Information

摘　　要：通过对覆铜板基材进行动态热机械分析(DMA),研究了温度校准和温度平衡罩对DMA测试覆铜板基材玻璃化转变温度(T_(g))影响。结果表明,在使用金属标准物质对DMA进行温度校准时,应在较低的温升速率下进行。DMA温度平衡罩适用于使用双悬臂、三点弯曲模式,不适用于拉伸模式测试样品的T_(g)。Through dynamic thermomechanical analysis of CCL substrates,the effects of temperature calibration and temperature balance mask on the glass transition temperature of CCL substrates tested by DMA were studied.The results show that the temperature calibration of DMA with metal standard materials should be performed at a lower temperature rise rate.The DMA temperature equilibration hood is suitable for testing the glass transition temperature of samples using double cantilever,three-point bending mode,but not in tensile mode.

关 键 词：动态热机械分析 玻璃化转变温度 温度校准 温度平衡罩 

分 类 号：TN41[电子电信—微电子学与固体电子学]