印制电路板制造中磁力线热熔工艺研究  

Research on hot melting technology of magnetic lines for Printed Circuit Board manufacturing

作　　者：苟辉 汪忠林 李冬 Gou Hui;Wang Zhonglin;Li Dong

机构地区：[1]中国航空工业集团公司西安航空计算技术研究所,陕西西安710068

出　　处：《印制电路信息》2022年第8期33-36,共4页Printed Circuit Information

摘　　要：磁力线热熔工艺已逐渐成为印制板层压过程中的主流工艺。文章主要从该工艺技术理论分析以及实际生产相结合两个方面来对该工艺进行改善,通过实验发现热熔区域阻流块、热熔温度与时间、防爆孔的设计均对印制板质量产生一定影响,文中针对这三项内容进行了深入分析研究,根据实验结果得出其最佳设计参数,并在实际生产过程中加以应用验证,提升了印制板的质量。The magnetic flux hot-melt process is gradually become the mainstream process in the printed board lamination process.This paper mainly improves the process from the theoretical analysis and the combination of actual production.It is found through experiments that the baffle block in the hot-melt area,the temperature and time of hot-melt,and the design of the explosion-proof hole can affect the quality of the printed board.In this paper,through in-depth study of these three contents,the optimal design parameters are obtained according to the experimental results,and verified in the actual production process,which improves the quality of the printed board.

关 键 词：磁力线热熔 层压 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]