飞秒激光加工高频挠性板基材微孔研究  

Study on Micro⁃holes Processing of High Frequency Flexible Copper Clad Laminate Substrate via Femtosecond Laser

作　　者：陆慧娟 欧卓东 黄兵 黄欣 王成勇[1] 郑李娟[1] LU Huijuan;OU Zhuodong;HUANG Bing;HUANG Xin;WANG Chengyong;ZHENG Lijuan(School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《机械科学与技术》2022年第8期1224-1230,共7页Mechanical Science and Technology for Aerospace Engineering

基　　金：国家自然科学基金优秀青年基金项目(52122510);珠海景旺柔性电路有限公司产学研合作项目。

摘　　要：为解决目前激光加工挠性覆铜板(简称挠性板)微孔存在的加工精度差、孔型差及热损伤大等问题,探索了飞秒激光加工高频挠性板基材⁃改性聚酰亚胺(MPI)微孔的材料去除过程及其加工质量。采用飞秒激光进行了改性聚酰亚胺微孔加工实验,使用热重⁃红外联用系统分析了改性聚酰亚胺材料热解机理,并利用激光共聚焦显微镜、场发射扫描电镜对改性聚酰亚胺微孔形貌进行了三维测量、显微观察及物性分析。结果表明:改性聚酰亚胺在飞秒激光作用下发生光化学和光热反应,材料以宽而圆滑的弧形沟壑形式逐层被去除,并形成了波纹阶梯、颗粒物堆积等烧蚀显微结构;加工过程中材料烧蚀反应随加工圈数的增加而减弱;微孔深度的变化速率基本保持不变,材料去除量随加工圈数的增加而减小并在最后剧增;飞秒激光可实现改性聚酰亚胺基材表面高质量微孔加工。In order to solve the poor processing accuracy,poor hole shape and large thermal damage in laser processing of micro⁃holes of flexible copper clad laminate(FCCL),the material removal process and processing quality of micro⁃holes in high frequency flexible copper clad laminate substrate modified polyimide(MPI)via femtosecond laser were explored.The experiment of MPI micro⁃holes processing via femtosecond laser was carried out.And the pyrolysis mechanism of MPI was analyzed by thermogravimetry infrared combined system.Then,laser confocal microscope and field emission scanning electron microscope are used to measure the micro⁃hole morphology.The results show that photochemical and photothermal reactions occur when the femtosecond laser act on the MPI substrate.And the MPI substrate was removed layer by layer in the form of wide and smooth arc gullies.Corrugated steps,particle accumulation,and other ablation microstructures were found in the material removal process.In the processing,the material ablation reaction decreased with the increasing of number of machining cycles.The change rate of micro⁃hole depth was basically unchanged.And the amount of material removal decreased with the increasing of processing turns but increased sharply in the end of processing.Femtosecond laser can realize high⁃quality micro⁃hole processing on the surface of modified polyimide substrate.

关 键 词：飞秒激光 高频挠性板 微孔 材料去除过程 加工质量 

分 类 号：TH16[机械工程—机械制造及自动化]