RB-SiC金刚石磨粒柔性刻划材料去除及表面损伤行为  

Material removal and surface damage behavior of diamond grain for flexible scribing RB-SiC

作　　者：王亚茹 李英杰 邹莱 韩聪聪 李昱潼 WANG Yaru;LI Yingjie;ZOU Lai;HAN Congcong;LI Yutong(College of Mechanical and Vehicle Engineering,Chongqing University,Chongqing 400044,China;Key Laboratory of Optical System Advanced Manufacturing Technology,Chinese Academy of Sciences,Changchun 130033,China;School of Mechatronics Engineering,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]重庆大学机械与运载工程学院,重庆400044 [2]中国科学院光学系统先进制造技术重点实验室,吉林长春130033 [3]哈尔滨工业大学机电工程学院,黑龙江哈尔滨150001

出　　处：《光学精密工程》2022年第14期1704-1715,共12页Optics and Precision Engineering

基　　金：中国科学院光学系统先进制造技术重点实验室开放基金资助项目(No.KLOMT-2019-01)。

摘　　要：反应烧结碳化硅(Reaction Bonded SiC,RB-SiC)因具有密度小、导热系数大、热稳定性好等优异性能,被公认为是理想的空间大型反射镜制造材料。然其成形后在表面精密加工过程中易引入加工损伤,故本文开展柔性刻划实验,探究砂带柔性磨削工艺对该材料加工性能的影响。通过刚性/柔性两种接触状态下单颗金刚石磨粒刻划RB-SiC材料的对比实验研究,获得柔性刻划下平均亚表面损伤率为0.677,而刚性刻划下为0.823。基于此,开展不同法向压力、磨粒角度、刻划速度等条件下的正交刻划实验研究,结果表明,法向压力与磨粒角度对材料损伤的影响更为重要;同时,随着法向压力的增大、磨粒角度的减小以及刻划速度的增大,材料损伤程度增加。最后,通过多颗金刚石磨粒刻划实验研究,得出结论:与单颗金刚石磨粒刻划相比,材料表面无严重破碎及损伤,且亚表面损伤层深度小于10μm。该研究将为砂带柔性磨削加工反应烧结碳化硅材料提供基础指导。RB-SiC is as an ideal material for manufacturing large space mirrors owing to its excellent properties such as low density,high thermal conductivity,and good thermal stability.However,it is easy to introduce processing damage during the precision machining of its formed surface.Therefore,flexible scribing experiments were conducted to investigate the effect of flexible grinding process with abrasive belts on the material.A comparative experiment using RB-SiC with rigid/flexible contact was conducted,and the average sub-surface injury ratio of flexibility and the rigid scribing was found to be 0.677 and 0.823,respectively.Based on this,the orthogonal scribing experiments with different normal pressure,abrasive angle,and scribing speed were performed.The results showed that the influence of normal pressure and abrasive angle on material damage was more significant.Meanwhile,with the increase in normal pressure,decrease in abrasive angle,and increase in scribing speed,the degree of material damage became larger.Finally,by examining the scribing with multiple diamond abrasive grains,it was concluded that compared with the scribing of single diamond abrasive grains,the surface of the material is not severely broken or damaged,and the depth of the subsurface damage layer was less than 10μm.This study will provide basic guidance for the flexible grinding of abrasive belts for RB-SiC.

关 键 词：反应烧结碳化硅 金刚石磨粒 损伤 刻划力 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]