Low-K芯片的激光开槽工艺质量稳定性控制  被引量:1

Quality Stability Control of Laser Grooving Process for Low-K Chip

在线阅读下载全文

作  者:李曼 彭川 冯晨 侯煜 宋琦 石海燕 王秋明[1] 张紫辰[1] LI Man;PENG Chuan;FENG Chen;HOU Yu;SONG Qi;SHI Haiyan;WANG Qiuming;ZHANG Zichen(Institute of Microelectronies of the Chinese Acarlemy of Sciences,Beijing 100029,China;The Military Representative Office of Air Force Equipmnet Department Stalioned in Wuhu,Wuhu241000,China;China Electronics Standardization Institute,Beijing 100007,China)

机构地区:[1]中国科学院微电子研究所,北京100029 [2]空军装备部驻芜湖地区军事代表室,安徽芜湖241000 [3]中国电子技术标准化研究院,北京100007

出  处:《电子产品可靠性与环境试验》2022年第4期17-23,共7页Electronic Product Reliability and Environmental Testing

摘  要:基于低介电常数(Low-K)材料覆盖的晶圆加工需求和激光开槽工艺质量控制特点,开展Low-K材料激光开槽工艺技术质量稳定性研究。以开槽宽度、槽壁夹角、开槽深度和底部波动距离表征槽型形貌特征,定义了激光开槽工艺质量评价准则。针对扫描速度、激光频率、单脉冲能量、扫描次数和脉宽5个因素以正交试验法开展Low-K芯片激光开槽槽型质量波动分析,得出影响槽型质量波动的主次顺序依次为激光频率>单脉冲能量>扫描速度>扫描次数>脉宽。提出了一套评定系统用于识别工艺质量最优参数,建立激光开槽工艺质量稳定性控制策略模型。经实例验证控制策略模型具备可行性,对Low-K材料激光开槽设备在工艺实施过程中的质量稳定性控制提供了有效的技术途径。Based on the wafer processing requirements of Low-K materials and the quality control characteristics of laser grooving process,the quality stability of laser grooving process for Low-K materials is studied.The groove width,groove wall angle,groove depth and bottom fluctuation distance are used to characterize the groove morphology,and the quality evaluation criteria of laser grooving process are defined.Orthogonal test are used to analyze the groove quality fluctuation of laser slotting for Low-K chips,which include scanning speed,laser frequency,single pulse energy,scanning times and pulse width.And it is found that the order of the factors affecting the groove quality fluctuation is laser frequency>single pulse energy>scanning speed>scanning times>pulse width.A set of evaluation system is proposed to identify the optimal parameters of process quality,and the control strategy model of laser grooving process quality stability is established.The feasibility of the control strategy model is verified by an example,which provides an effective technical way for the quality stability control of Low-K material laser grooving equipment in the process of process implementation.

关 键 词:工艺质量 质量稳定性 激光开槽 

分 类 号:TN305.1[电子电信—物理电子学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象