印制板组件中氯离子腐蚀失效案例分析  

Analysis of the Failure Cases of Chloride Ion Corrosion in PCBA

作　　者：张培强 甘吉松 唐雁煌 张莹洁 朱刚 刘子莲[2] ZHANG Peiqiang;GAN Jisong;TANG Yanhuang;ZHANG Yingjie;ZHU Gang;LIU Zilian(CEPREI,Cuangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]工业和信息化部电子第五研究所元器件可靠性研究分析中心,广东广州511370

出　　处：《电子产品可靠性与环境试验》2022年第4期35-40,共6页Electronic Product Reliability and Environmental Testing

摘　　要：在印制板组件众多的失效中,氯离子所引发的腐蚀、电迁移等是最为常见的失效模式。深度剖析了两个由氯离子引起电路板失效的典型案例,阐述了案例背景、分析过程、失效原因和失效机理,并提出了实际可行的解决方法与改善建议,对提高产品可靠性有一定的参考价值。Corrosion and electromigration caused by chloride ions are the most common failure modes among many failure of PCBA.Two typical cases of circuit board failure caused by chloride ions are deeply analyzed,and the case background,analysis process,failure cause and failure mechanism are expounded,and practical solutions and improvement suggestions are proposed,which has certain reference value for improving the reliability of products.

关 键 词：印制板组件 氯离子 失效分析 短路 打火 改善建议 

分 类 号：TN41[电子电信—微电子学与固体电子学]