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作 者:刘超 孙旋[1] 王傲冰[2,3,4] 赵利颇[2,3,4] 田明 LIU Chao;SUN Xuan;WANG Aobing;ZHAO Lipo;TIAN Ming(Center of Science and Technology,Xingtai Polytechnic College,Xingtai 054000,China;Department of Mechanical and Electrical Engineering,Xingtai Polytechnic College,Xingtai 054000,China;Small and Medium-sized Non-standard Equipment Technology Innovation Center of Hebei Province,Xingtai Polytechnic College,Xingtai 054000,China;Valve Intelligent Manufacturing Equipment Engineering Research Center of Hebei Province,Xingtai Polytechnic College,Xingtai 054000,China;Department of Resources and Environmental Engineering,Xingtai Polytechnic College,Xingtai 054000,China)
机构地区:[1]邢台职业技术学院科技发展中心,邢台054000 [2]邢台职业技术学院机电工程系,邢台054000 [3]邢台职业技术学院河北省中小型非标装备技术创新中心,邢台054000 [4]邢台职业技术学院河北省阀门智能制造装备工程研究中心,邢台054000 [5]邢台职业技术学院资源与环境工程系,邢台054000
出 处:《机械工程材料》2022年第6期26-30,共5页Materials For Mechanical Engineering
基 金:2020年邢台市市级科技计划青年人才及软科学专项项目(2020ZZ045)。
摘 要:通过950℃高温压缩试验模拟实际GH4169合金锻造加工过程,研究施加不同密度(0~4.5 kA·mm^(-2))脉冲电流条件下合金的高温压缩变形及动态再结晶行为,并对脉冲电流的影响机制进行讨论。结果表明:在脉冲电流作用下,压缩时合金更易屈服变形,压缩变形抗力降低,且随着脉冲电流密度增大,压缩变形抗力降低程度更大,这与脉冲电流产生的电子风力促进位错运动有直接关系;随着脉冲电流密度的增大,合金发生一次再结晶后发生二次再结晶,这是因为脉冲电流可促进原子扩散,导致亚晶界迁移难度降低,从而对动态再结晶具有促进作用。The processing of GH4169 alloy forgings was simulated by 950℃high temperature compression test.The high temperature compression deformation and dynamic recrystallization behavior of the alloy under the conditions of pulse current with different densities(0-4.5 kA·mm^(-2)),and the influence mechanism of pulse current was discussed.The results show that the alloy was more prone to yield during compression under the action of pulse current,and the compressive deformation resistance decreased;the decrease degree of compressive deformation resistance become more obvious with increasing pulse current density,which was directly related to the fact that the electronic wind force generated by pulse current promoted the dislocation motion.With increasing pulse current density,secondary recrystallization occurred after primary recrystallization,this was because that the pulse current could promote atom diffusion,reduce the difficulty of grain boundary migration and promote dynamic recrystallization.
分 类 号:TG146.1[一般工业技术—材料科学与工程]
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