Preface to Special Issue on Electronic Electroplating  

作　　者：Zhi-Dong Chen Chong Wang Wei He Ming Li 

机构地区：[1]School of petrochemical engineering,Changzhou University,Changzhou 213164,Jiangsu,China [2]School of Materials and Energy,University of Electronic Science and Technology of China [3]School of Materials Science and Engineering,Shanghai Jiao Tong University,Shanghai,200240,China

出　　处：《电化学》2022年第7期1-3,共3页Journal of Electrochemistry

摘　　要：Electroplating is a process using electric current to deposit a layer of metal(s),which is an indispensable technique in the manufacture of integrated circuits and micro-nano electronic devices.Electroplating for modern electronics is much smaller in scale than the ordinary electroplating processes and relies heavily on foreign technique,such as proprietary materials and equipment.As the competition in the field of chip manufacture intensifies,we realize that there is no choice but to become self-sufficient in such technology,including,but not limited to electroplating technology.

关 键 词：technology. ELECTROPLATING ordinary 

分 类 号：TQ153[化学工程—电化学工业]