纳米颗粒对倒装芯片焊点微观结构和性能的影响综述  

Review on the Effect of Nanoparticles on the Microstructure and Performance of Flip Chip Solder Joints

作　　者：张城 翟鑫梦 陈跃 李月锋 邹军 石明明 杨波波 苏晓锋 杨雪舟 钱麒 ZHANG Cheng;ZHAI Xinmeng;CHEN Yue;LI Yuefeng;ZOU Jun;SHI Mingming;YANG Bobo;SU Xiaofeng;YANG Xuezhou;QIAN Qi(School of Science,Shanghai Institute of Technology,Shanghai 201418,China;Yantai Huachuang Intelligent Equipment Co.,Ltd.,Yantai 264006,China;Ningbo Longer Lighting Co.Ltd.,Ningbo 315300,China;Huichuang Technology(Taizhou)Co.,Ltd.,Taizhou 318050,China)

机构地区：[1]上海应用技术大学理学院,上海201418 [2]烟台华创智能装备有限公司,山东烟台264006 [3]宁波朗格照明电器有限公司,浙江宁波315300 [4]惠创科技(台州)有限公司,浙江台州318050

出　　处：《照明工程学报》2022年第4期82-92,共11页China Illuminating Engineering Journal

基　　金：上海联盟计划(LM201978);国家自然基金青年基金(51302171);上海市学科能力建设项目(14500503300);上海市产学合作项目(沪XY-2013-61);校企合作项目(sit20170824001)。

摘　　要：倒装LED芯片克服了正装LED芯片的不足,提高了LED器件的可靠性和使用寿命。在实际生产过程中,焊接工艺是倒装芯片封装过程中的关键步骤,倒装LED芯片互连界面的可靠性被认为是最重要的可靠性问题之一。随着微电子封装的发展和焊点使用环境的日益特殊,对无铅焊料的性能提出了更加严格的要求。由于小尺寸效应和高表面能,纳米颗粒已被广泛用于改善无铅焊料的微观结构和性能。因此,含有纳米颗粒的复合焊料最近引起了广泛关注。本文回顾了近年来对SnAgCu复合焊料合金的研究,并介绍了纳米颗粒对其微观结构、机械性能、润湿性和可靠性的影响。分析总结了纳米粒子强化的机理。此外,还讨论了纳米颗粒增强无铅焊料的不足和未来发展趋势,希望为这些复合焊料在封装中的应用提供一定的理论参考。Flip-chip LED chips overcome the shortcomings of formal LED chips and improve the reliability and service life of LED devices.In the actual production process,the soldering process is a key step in the flip-chip packaging process,and the reliability of the interconnection interface of the flip-chip LED chip is considered to be one of the most important reliability issues.With the development of microelectronic packaging and the increasingly special use environment of solder joints,more stringent requirements are put forward for the performance of lead-free solders.Due to the small size effect and high surface energy,nanoparticles have been widely used to improve the microstructure and performance of lead-free solders.Therefore,composite solder containing nanoparticles has recently attracted widespread attention.This article reviews recent research on SnAgCu composite solder alloys,and introduces the effects of nanoparticles on their microstructure,mechanical properties,wettability and reliability.In addition,the deficiencies and future development trends of nanoparticle-enhanced lead-free solders are also discussed,hoping to provide a certain theoretical reference for the application of these composite solders in packaging.

关 键 词：复合焊料 纳米粒子 微观结构 机械性能 润湿角 

分 类 号：TN304.0[电子电信—物理电子学]