Ni颗粒对Sn58Bi/Cu(Ni)接头组织及性能影响  

Microstructure and Properties of Sn58Bi/Cu(Ni) Joint with Ni Particles

作　　者：李正兵 陈益平[1] 胡德安[1] 程东海[1] 杨起[1] 何凯 Li Zhengbing;Chen Yiping;Hu Dean;Cheng Donghai;Yang Qi;He Kai(School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330036,China)

机构地区：[1]南昌航空大学航空制造工程学院,江西南昌330063

出　　处：《稀有金属》2022年第7期889-895,共7页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(51865034);江西省自然科学基金项目(20161BAB216100)资助。

摘　　要：针对Sn58Bi合金在服役过程中组织稳定性差的问题,通过扫描电镜(SEM)观察时效前后Sn58Bi-0.5Ni/Cu(Ni)接头的组织,结合能谱(EDS)测试分析接头组织变化,利用万能试验机分析接头力学性能,研究Ni颗粒和Cu基板化学镀Ni(p)联合处理方式对Sn58Bi接头组织及性能的影响。研究结果表明,向Sn58Bi/Cu(Ni)接头中加入Ni颗粒,可以提高焊后接头的力学性能,接头力学性能比Sn58Bi/Cu接头和Sn58Bi/Cu(Ni)接头均高,且Sn58Bi-0.5Ni/Cu(Ni)接头的力学性能最好,达到54.35 MPa;单纯在Cu基板表面镀Ni(p)不仅可以有效抑制界面IMC的生长速率,还可以抑制界面Bi相偏析,提高界面组织在时效过程中的稳定性,但界面处过厚的Ni_(3)P层化合物将会影响接头力学性能;向Sn58Bi/Cu(Ni)接头中加入0.5%(质量分数)的Ni颗粒,不仅没有改变界面金属化合物层的种类,还减缓界面IMC层和Ni_(3)P层的生长速率,提高界面组织的服役稳定性,提高接头在服役过程中的力学性能。With the attention to environmental protection problems,the research and attention on lead-free solder material have grad⁃ually increased,among which the Sn-Bi solder material alloy was widely concerned due to the advantages of low melting point,good tensile strength,good reliability and good creep,especially the cocrystalline Sn58Bi solder with low melting point.However,Sn58Bi alloy has Bi phase polarization and interface Bi phase during service,reducing the reliability of joints.In order to effectively improve the phase polarization of Bi in Sn58Bi alloy,Sn58Bi/Cu(Ni)joints were prepared by joint treatment of Ni particles and plated Ni(p)layer to study its influence on the organization and performance of Sn58Bi/Cu joints.The material used in this experiment was 2 mm thick purple copper substrate,medium phosphorus chemical plating Ni liquid(coating was amorphous).The Sn58Bi-Ni composite sol⁃der used in the experiment was by adding nanometer Ni particles to Sn58Bi solder,and then using mechanical mixing,mixing solder and particles,where the Ni particle content(mass fraction)in Sn58Bi-Ni composite solder was 0.3%,0.5%and 1.0%,respectively.Two Cu(or Cu(Ni))substrates of Sn58Bi-Ni composite solder were welded,equal weld thickness was controlled,and then the joint in the resistor furnace was heated to prepare the workpiece.The post welding workpiece was put in the constant temperature incubator at 120℃with duration of 0,24,72,120 and 216 h,respectively.Then the workpieces were cut by a wire cut machine to prepare the test specimen.After a series of coarse grinding and fine throwing of gold phase test samples,it was analysised by scanning electron mi⁃croscope(SEM)and energy dispersive spectroscopy(EDS)analysis.The tensile specimens were teated at 25℃using a WDW-100 microcomputer controlled electronic universal test machine with a shear speed of 1 mm·min^(-1).To ensure accurate accuracy,the joint shear strength took the average of 3 specimens.To solve the problem of poor tissue stability of Sn58Bi alloy duri

关 键 词：颗粒增强 N(i p)镀层 联合处理 力学性能 界面组织 

分 类 号：TG454[金属学及工艺—焊接]