微硅粉对硅酸盐无机粘结剂砂抗吸湿性的影响  

Effect of Microsilicon Powder on Hygroscopic Resistance of Silicate Inorganic Bonded Sand

作　　者：殷亚军[1] 文艺贝 祁雨阳 万鹏[1] 谢垚 王东新 李文[1] 李远才[1] 周建新[1] YIN Ya-jun;WEN Yi-bei;QI Yu-yang;WAN Peng;XIE Yao;WANG Dong-xin;LI Wen;LI Yuan-cai;ZHOU Jian-xin(State Key Laboratory of Materials Processing and Die&Mould Technology,Huazhong University of Science and Technology,Wuhan 430074,China;State Key Laboratory of Special Rare Metal Materials,Northwest Rare Metal Materials Research Institute Ninaxia Co.,Ltd.,Shizuishan 753000,China)

机构地区：[1]华中科技大学材料成形与模具技术国家重点试验室,湖北武汉430074 [2]西北稀有金属材料研究院宁夏有限公司稀有金属特种材料国家重点试验室,宁夏石嘴山753000

出　　处：《现代铸铁》2022年第4期48-52,共5页Modern Cast Iron

基　　金：“两机”重大专项基础研究(2017-Ⅶ-0008-0102);稀有金属特种材料国家重点试验室开放课题基金(SKL2018K004);中央引导地方科技发展专项(2020);中国有色集团科技计划项目(2018KJJH05);宁夏回族自治区产业创新揭榜项目(20200108);国家重点研发计划“网络协同制造和智能工厂”(2020YFB1710100);国家自然科学基金(51905188)。

摘　　要：研究了微硅粉附加物对新型硅酸盐无机粘结剂砂抗吸湿性的影响。试验结果表明:微硅粉的加入促进缩合反应,使无机高聚合粘结体系更复杂,减轻了外界水分对粘结网络的攻击;当微硅粉加入量为0.8%(占砂重)时效果最好,型(芯)砂试样在高湿度下存放24 h后的强度损失率由74.48%降低至19.59%;当微硅粉的加入量较少时,型(芯)砂试样内部缩聚反应虽有较大程度提高,但反应不充分、粘结网络内部硬化速度不均匀,导致水分无法及时排除,对抗湿强度造成不利影响;当微硅粉加入量过多时,造成了粘结剂的浪费,使其粘结利用率大幅降低,使得抗湿强度急剧下降。The influence of microsilicon powder on hygroscopic resistance of the new type inorganic bonded sand was investigated.The test results showed:the addition of microsilicon powder promotes the condensation reaction,made the inorganic high polymerization bonding system more complex,and reduced the attack of external water on the bonding network.When the adding amount of micro silicon powder was 0.8%(of sand weight),the effect was the best,the strength loss rate of the molding(core)sand sample stored in high humidity for 24 h was reduced from 74.48%to 19.59%.When the adding amount of microsilicon powder was less,although the internal condensation reaction of the molding(core)sand sample had been improved to a large extent,but the reaction was not sufficient,the bonding network internal hardening speed was not uniform that caused the water couldn’t be excluded in time,and caused adverse effects on the wet strength.When the adding amount of the microsilicon powder was too more,the waste of binder was caused,so that its bonding utilization rate was greatly reduced,making the moisture resistance strength drops sharply.

关 键 词：硅酸盐粘结剂 微硅粉 抗吸湿性 

分 类 号：TG221[金属学及工艺—铸造]