多层共烧陶瓷孔壁金属化工艺常见缺陷分析  

Common Defects Analysis of Multilayer Co-fired Ceramic Via Metallization

作　　者：李伟 王元仕 郭婷婷 LI Wei;WANG Yuanshi;GUO Tingting(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2022年第3期14-17,共4页Equipment for Electronic Products Manufacturing

摘　　要：对多层共烧陶瓷封装用零部件制造过程中的孔壁金属化工艺开发了专用工装设备,并介绍了主要结构原理及其工艺技术难点。就设备生产使用过程中的常见缺陷形式进行了记录,分析了其成因和预防要点,为后续工艺提高及判断提供了基础研究。The customized equipment is developed to realize via metallization during the multilayer Co-fired ceramic packaging parts fabrication.The main structure,principle and process difficulties are presented in this paper.Common defects of via metallization during production are recorded,analyzed and prevented,which provides the basis material for process improvement in the future.

关 键 词：多层共烧陶瓷技术 孔壁金属化 缺陷分析 

分 类 号：TN305.94[电子电信—物理电子学]