酚酞聚芳醚腈酮/石墨烯导热复合材料的制备与性能  

Preparation and properties of polyaryl ether ketone/graphene thermal conductive composites

作　　者：王元泽 曲敏杰 王豆 徐培琦 周光远 吴立豪 WANG Yuanze;QU Minjie;WANG Dou;XU Peiqi;ZHOU Guangyuan;WU Lihao(School of Textile and Material Engineering,Dalian Polytechnic University,Dalian 116034,China;Dalian Institute of Chemical Physics,Chinese Academy of Sciences,Dalian 116023,China;Dalian Jiangyu New Material Science and Technology Company Limited,Dalian 116600,China)

机构地区：[1]大连工业大学纺织与材料工程学院,辽宁大连116034 [2]中国科学院大连化学物理研究所,辽宁大连116023 [3]大连疆宇新材料科技有限公司,辽宁大连116600

出　　处：《大连工业大学学报》2022年第4期282-286,共5页Journal of Dalian Polytechnic University

基　　金：辽宁省教育厅科学研究项目(J2020007).

摘　　要：采用高温模压法,以酚酞聚芳醚腈酮(PEK-CN)为基体,不同种类的石墨烯(GR)为导热填料,制备了PEK-CN/GR导热复合材料,考察了石墨烯种类的差异对PEK-CN/GR导热复合材料导热性能、热稳定性和界面结合情况的影响。结果表明,不同种类石墨烯的加入均能有效地提高PEK-CN/GR的导热系数与玻璃化转变温度,填料为浆料石墨烯时复合材料的导热系数和玻璃化转变温度分别为0.51 W/(m·K)和231.32℃,当填料为浆料石墨烯、羧基化石墨烯时复合材料的储能模量、损耗模量高于纯PEK-CN。石墨烯与基体结合更加紧密,有更高的界面结合强度。The thermal conductive polyaryl ether ketone(PEK-CN)/graphene(GR)composites were prepared by high temperature molding method with PEK-CN as matrix and various graphene as thermal conductive filler.The effects of types of graphene on the thermal conductivity,thermal stability and interfacial bonding of PEK-CN/graphene composites were studied.The results showed that the thermal conductivity and glass transition temperature of PEK-CN/GR was effectively increased after addition of various graphene.The thermal conductivity and glass transition temperature of the composites were 0.51 W/(m·K)and 231.32℃,respectively,using graphene as the filler.The storage and loss modulus of the composites were higher than those of pure PEK-CN with slurry and carboxyl graphene as filler.Graphene was connected with matrix more closely and imparted higher interfacial bonding strength to the composites.

关 键 词：酚酞聚芳醚腈酮 石墨烯 导热性能 复合材料 

分 类 号：TQ322.9[化学工程—合成树脂塑料工业]