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作 者:郑刚 朱慧盈 余双敏 ZHENG Gang;ZHU Huiying;YU Shuangmin(Shanghai Electric Power Generation Equipment Co.,Ltd.,Generator Plant,Shanghai 200240,China)
机构地区:[1]上海电气电站设备有限公司发电机厂,上海200240
出 处:《绝缘材料》2022年第9期47-51,共5页Insulating Materials
摘 要:为了研究高导热(HTC)云母带的导热性能,对不同的高导热VPI少胶云母带的微观结构进行剖析,提出了一种高导热少胶云母带的导热性能测试方法,探讨了云母带导热系数的综合评估方法。结果表明:在现有VPI体系下,采用高导热云母带的主绝缘比采用常规云母带的主绝缘导热系数最高能提升45%,用综合导热系数λs来衡量高导热云母带的贡献更为客观全面,采用高导热云母带比常规云母带的主绝缘综合导热系数最高能提升33%。In order to study the thermal conductivity of high thermal conductive(HTC) mica tape, the micro structure of different high thermal conductive VPI dry mica tapes were analyzed, and a thermal conductivity test method of HTC dry mica tape was proposed. A comprehensive evaluation method of thermal conductivity was discussed. The results show that under the existing VPI system, the thermal conductivity of the main insulation with high thermal conductive mica tape increase by up to 45% compared with the main insulation with conventional mica tape. Using the comprehensive thermal conductivity λsto measure the contribution of high thermal conductive mica tape is more objective and comprehensive, and the comprehensive thermal conductivity of the main insulation with high thermal conductive mica tape increase by up to 33% compared with the main insulation with conventional mica tape.
分 类 号:TM215[一般工业技术—材料科学与工程]
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