TXV Technology:The cornerstone of 3D system-in-packaging  

作　　者：ZHAO HeRan CHEN MingXiang PENG Yang WANG Qing KANG Min CAO LiHua 

机构地区：[1]School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China [2]The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110000,China [3]State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University of Science and Technology,Wuhan 430074,China [4]School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China [5]Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [6]Shenyang National Laboratory for Materials Science,Shenyang 110016,China

出　　处：《Science China(Technological Sciences)》2022年第9期2031-2050,共20页中国科学（技术科学英文版）

基　　金：supported by the Aerospace S&T Group Application Innovation Program Project(No:09428ADA);the Key Research and Development Project of Hubei Province(Grant Nos.2020BAB068 and 2021BAA071)。

摘　　要：System-in-packaging(Si P) can realize the integration and miniaturization of electronic devices and it is significant to continue Moore’s law.Through-X-via(TXV) technology is the cornerstone of 3 D-SiP,which enables the vertical stacking and electrical interconnection of electronic devices.TXV originated from through-hole(TH) in PCB substrates and evolved in different substrate materials,such as silicon,glass,ceramic,and polymer.This work provides a comprehensive review of four distinguishing TXV technologies(through silicon via(TSV),through glass via(TGV),through ceramic via(TCV),and through mold via(TMV)),including the fabrication mechanisms,processes,and applications.Every TXV technology has unique characteristics and owns particular processes and functions.The process methods,key technologies,application fields,and advantages and disadvantages of each TXV technology were discussed.The cutting-edge through-hole process and development direction were reviewed.

关 键 词：through silicon via(TSV) through ceramic via(TCV) through glass via(TGV) through mold via(TMV) 3D packaging chip stacking interposer 

分 类 号：TN405[电子电信—微电子学与固体电子学]