半固态等温热处理对Al-Cu-Mn合金组织的影响  

Effect of Semi-Solid Isothermal Heat Treatment on Microstructure of Al-Cu-Mn Alloy

作　　者：柴兴强 阎峰云[1,2] CHAI Xing-qiang;YAN Feng-yun(School of Materials Science and Engineering,Lanzhou University of Technology,Lanzhou 7300050,Gansu,China;Slate Key Laboratory of Advanced Processing and Reuse of Non-Ferrous Metals Jointly Established by the Provincial and Ministerial Departments,Lanzhou University of Technology,Lanzhou 7300050,Gansu,China)

机构地区：[1]兰州理工大学材料科学与工程学院,甘肃兰州730050 [2]兰州理工大学,省部共建有色金属先进加工再利用国家重点试验室,甘肃兰州730050

出　　处：《铸造》2022年第8期985-989,共5页Foundry

摘　　要：研究半固态等温热处理工艺对Al-Cu-Mn合金组织的影响规律。对Al-Cu-Mn合金进行了不同的保温温度和保温时间,探究了保温温度和保温时间对Al-Cu-Mn合金半固态坯料的平均等圆直径、固相率和形状因子的影响规律。Al-Cu-Mn合金在保温温度630℃、保温时间50 min时,其半固态坯料组织最适合后续触变成形。坯料的固相率为55.9%,平均等圆直径为146μm,形状因子为1.4。当保温时间相同时,随着保温温度的增加,晶粒尺寸和晶粒的球化程度都会增加。当保温温度相同时,随着保温时间的增加,晶粒尺寸增大,晶粒圆整度增加。The influence of semi-solid isothermal heat treatment process on the microstructure of Al-Cu-Mn alloy was studied. The Al-Cu-Mn alloy was subjected to different holding temperatures and holding times, and the influences of the holding temperature and holding time on the average equal circle diameter, solid phase ratio and shape factor of the Al-Cu-Mn alloy semi-solid billet were explored. The semi-solid billet microstructure of the Al-Cu-Mn alloy at the holding temperature of 630 ℃ and holding time of 50 min was the most suitable for subsequent thixoforming. The solid phase ratio of the billet was 55.9%. The average equal circle diameter was 146 μm, and the shape factor was 1.4. When the holding time was the same, with the increase of the holding temperature, the grain size and the degree of spheroidization of the crystal grains increased;when the holding temperature was the same, with the increase of the holding time, the grain size increased, and the roundness of the grains were increased.

关 键 词：等温热处理 半固态 AL-CU-MN合金 晶粒大小 圆整度 

分 类 号：TG146.21[一般工业技术—材料科学与工程]