Cu-5Fe合金薄带和箔材组织与性能研究  

Microstructure and Properties of Cu-5Fe Alloy Thin Strip and Foil

作　　者：温佳明 颜朝波 王文斌 郭创立 周斌 梁建斌 孙君朋 王群 黎晓华[1,2] Wen Jiaming;Yan Chaobo;Wang Wenbin;Guo Chuangli;Zhou Bin;Liang Jianbin;Sun Junpeng;Wang Qun;Li Xiaohua(Shenzhen Key Laboratory of Special Functional Materials;College of Materials Science and Engineering,Shenzhen University;Xi′an Sirui Advanced Copper Alloy Technology Co.,Ltd.)

机构地区：[1]深圳市特种功能材料重点实验室 [2]深圳大学材料学院 [3]西安斯瑞先进铜合金科技有限公司

出　　处：《特种铸造及有色合金》2022年第8期1012-1015,共4页Special Casting & Nonferrous Alloys

摘　　要：以非真空感应熔炼、半连续铸造和冷轧以及精轧制备的Cu-5Fe薄带和箔材为研究对象,采用金相电镜、数字电导率测试仪、XRD、热膨胀仪、激光热导仪和PPMS等手段研究合金的显微组织与性能。结果表明,Cu-5Fe合金具有高导、高强(19.72 MS/m、580 MPa)和优良的导热性[267 W/(m·K)]、延展性以及独特的电磁屏蔽特性。The microstructure and properties of Cu-5 Fe thin strip and foil prepared by non-vacuum induction melting,semi-continuous casting,cold rolling and fine rolling were investigated by means of metallographic electron microscopy,digital conductivity tester,XRD thermal expansion tester,laser thermal conductivity tester and PPMS.The results indicate that Cu-5 Fe alloy has high conductivity(19.72 MS/m) and strength(580 MPa),excellent thermal conductivity[267 W/(m·K)] and ductility,and unique electromagnetic shielding characteristics.

关 键 词：Cu-5Fe合金 高强高导 显微组织 薄带和箔材 电磁屏蔽 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG113.25[金属学及工艺—金属材料]