探讨混合微电路用多芯组瓷介电容加固  

Discussion on the Reinforcement of Multi-core Group Ceramic Capacitors for Hybrid Microcircuits Industrial

作　　者：刘丹 Liu Dan(Sichuan Institute of Industrial Technology,Deyang 618000,China)

机构地区：[1]四川工业科技学院,四川德阳618000

出　　处：《科学技术创新》2022年第26期22-25,共4页Scientific and Technological Innovation

摘　　要：为了更加全面地了解多芯组瓷介电容器,以及其在应用中的优势与作用,针对混合微电路中多芯组瓷介电容的加固处理展开分析。首先介绍多芯组瓷介电容器,了解瓷介电容器运行原理、结构、基本参数和类型。其次介绍混合微电路中多芯组瓷介电容加固的根本原因与方法,分别介绍载片直接粘接在多芯组瓷介电容底部、多芯组瓷介电容一侧贴装载片这两种加固方法,对比两种方法在应用中的优、缺点。最后对加固检验效果作出检验,明确最适合混合微电路需求的多芯组瓷介电容加固方式,加强瓷介电容安装稳定性与可靠性,旨在为今后混合微电路多芯组瓷介电容加固作业与处理提供有实际价值的参考意见。In order to have a more comprehensive understanding of multi-core ceramic capacitors and their advantages and functions in application,the reinforcement treatment of multi-core ceramic capacitors in hybrid microcircuits is analyzed.Firstly,introduce the multi-core group ceramic capacitors,and understand the operation principle,structure,basic parameters and types of ceramic capacitors.Secondly,the fundamental reasons and methods of reinforcement of multi-core group ceramic capacitors in hybrid microcircuits are introduced.The two reinforcement methods of directly bonding the carrier to the bottom of multi-core group ceramic capacitors and sticking the carrier to one side of multi-core group ceramic capacitors are introduced respectively,and the advantages and disadvantages of the two methods in application are compared.Finally,the effect of reinforcement inspection is tested,and the reinforcement method of multi-core group ceramic capacitors that is most suitable for the needs of hybrid microcircuits is clarified,so as to strengthen the stability and reliability of ceramic capacitor installation,in order to provide practical reference opinions for the reinforcement operation and treatment of multi-core group ceramic capacitors in hybrid microcircuits in the future.

关 键 词：混合微电路 多芯组瓷介电容器 加固 

分 类 号：TM53[电气工程—电器] TN405[电子电信—微电子学与固体电子学]