功率器件芯片软钎焊空洞的优化方法  

Optimization Method for Chip Soldering Voids in Power Devices

作　　者：潘永涛 陶涛 Pan Yongtao

机构地区：[1]常州银河世纪微电子股份有限公司,江苏常州213000

出　　处：《工业控制计算机》2022年第9期138-139,142,共3页Industrial Control Computer

摘　　要：半导体功率器件作为最常见的电子电力器件之一,被广泛应用于生产生活中。器件生产过程中,大多采用铅锡银合金软钎焊,常见的焊接空洞问题会极大地影响器件的工作效率和使用寿命,因此如何在工业生产中解决铅锡银合金软钎焊空洞问题就尤为重要。以企业贴片功率二极管器件为样本,采用一系列方法解决软钎焊空洞问题。方法包括助焊剂成分比例的优化、锡球粉的合理选择、焊接曲线的优化、焊接炉的选择、钎焊焊膏量的控制方法。将这些方法应用于企业实际生产中,焊接空洞问题得到了明显改善。The problem of soldering voids will significantly affect the device’s working efficiency and service life in the process of device production.Solving the problem of soldering voids in industrial production is particularly important.This paper takes the welding of enterprise power devices as a sample and adopts a series of methods to solve the problem of welding voids.The methods include optimization of the proportion of flux components,reasonable selection of solder ball powder,optimization of soldering curve,selection of soldering furnace,and control method of solder dispensing amount.

关 键 词：功率器件 焊接 空洞 焊接曲线 

分 类 号：TG454[金属学及工艺—焊接] TN405[电子电信—微电子学与固体电子学]