TA15/Ti2AlNb扩散连接界面组织及变形研究  

Study on interface microstructure and deformation during the diffusion bonding of TA15/Ti2AlNb

作　　者：周贤军 武永 秦中环 李保永[3] 陈明和[1] ZHOU Xian-jun;WU Yong;QIN Zhong-huan;LI Bao-yong;CHEN Ming-he(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Shanghai Spaceflight Precision Machinery Institute,Shanghai 201600,China;Hangxing Machinery Manufacturing Co.,Ltd.,Beijing 100013,China)

机构地区：[1]南京航空航天大学机电学院,江苏南京210016 [2]上海航天精密机械研究所,上海201600 [3]北京航星机器制造有限公司,北京100013

出　　处：《塑性工程学报》2022年第9期120-126,共7页Journal of Plasticity Engineering

基　　金：国家自然科学基金资助项目(51805256)。

摘　　要：研究了扩散连接温度和压力对TA15/Ti2AlNb异种材料连接质量及微观组织的影响,并利用ABAQUS有限元仿真软件分析了扩散连接过程中TA15钛合金的蠕变变形行为。结果表明,在910、930和950℃下分别施加3、6和9 MPa扩散压力120 min后,TA15/Ti2AlNb扩散连接焊合率均超过95%,连接界面无明显缺陷。连接界面晶粒呈片层形态,Ti和Nb元素含量在连接界面变化明显。扩散连接界面厚度随温度升高而增大,随压力增大而减小。TA15钛合金母材发生蠕变变形,且各区域变形量分布不同,导致扩散连接界面各处晶粒尺寸差异明显。通过对比分析发现,TA15/Ti2AlNb扩散连接的适宜参数为扩散温度为930℃、扩散压力为3 MPa和扩散时间为120 min。The effects of diffusion bonding temperature and pressure on the bonding quality and microstructure of TA15/Ti2AlNb dissimi-lar materials were studied,and the creep deformation behavior of TA15 titanium alloy during diffusion bonding was analyzed by ABAQUS finite element simulation software.The results show that the bonding rate of TA15/Ti2AlNb diffusion bonding exceeds 95%after applying diffusion pressure of 3,6 and 9 MPa at 910,930 and 950℃for 120 min,respectively,and the bonding interface has no obvious defects.The grains at the bonding interface are lamellar like,and the content of Ti and Nb element changes obviously at the bonding interface.The thickness of diffusion bonding interface increases with the increase of temperature and decreases with the increase of pressure.TA15 tita-nium alloy base metal experiences creep deformation,and the distribution of deformation in each region is different,which results in ob-vious difference of grain size at different regions in diffusion bonding interface.Through comparative analysis,it is found that the suit-able parameters for TA15/Ti2AlNb diffusion bonding are diffusion temperature of 930℃,diffusion pressure of 3 MPa and diffusion time of 120 min.

关 键 词：TI2ALNB TA15 扩散连接 微观组织 蠕变变形 

分 类 号：TG132[一般工业技术—材料科学与工程]