自动封装设备模具温度控制系统的研究  

Study of Mold Temperature Control Cystem for Automatic Packaging Equipment

作　　者：方唐利 Fang Tangli(Anhui Nextool Technology Co.,Ltd.,Tongling,Anhui 244061,CHN)

机构地区：[1]安徽耐科装备科技股份有限公司,安徽铜陵244061

出　　处：《模具制造》2022年第9期40-43,共4页Die & Mould Manufacture

摘　　要：以集成电路自动封装设备模具温度控制为研究对象,为满足集成电路自动封装设备对模具温度控制的高精度、高可靠性的要求,设计了新型模具温控制系统。该温度控制系统根据塑封工艺对模温的具体要求,重新设计了加热棒和热电偶的布局,同时增加动态模温补偿机制,解决了现有温控系统升温慢、模温一致性差等技术难点。Taking the IC automatic packaging equipment of the mold temperature control as controlled plant.Targeting the high-precision and high reliability of the mold temperature control for the IC automatic packaging equipment,design of mold temperature control cystem.This temperature control system is based on the specific requirements of the mold temperature of the plastic sealing processr.Redesigned layout of heating rods and thermocouples.At the same time,a dynamic mold temperature compensation mechanism is added.Solve the existing temperature control system slow temperature rise,mold temperature consistency and other technical difficulties.

关 键 词：集成电路 模具 温度控制 PLC 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]