基于协同仿真技术的超宽带射频微系统热电设计  

Thermoelectric Design of Ultra-wideband RF Microsystem Based on Co-simulation Technology

作　　者：朱臣伟 刘娟[1] 唐昊[2] 赵逸涵 葛振霆 魏然[1] 铁清木 ZHU Chenwei;LIU Juan;TANG Hao;ZHAO Yihan;GE Zhenting;WEI Ran;TIE Qingmu(Nanjing Institute of Electronic Devices,Nanjing,210016,CHN;University of Electronic Science and Technology of China,Chengdu,611731,CHN;Yunnan University,Kunming,650500,CHN)

机构地区：[1]南京电子器件研究所,南京210016 [2]电子科技大学,成都611731 [3]云南大学,昆明650500

出　　处：《固体电子学研究与进展》2022年第4期269-274,286,共7页Research & Progress of SSE

摘　　要：随着芯片集成度提高,射频微系统性能提升、封装尺寸减小和高密度集成技术进步,电热耦合问题日益加剧。针对该问题,本文基于多物理场电热协同仿真方法开展相关研究。研究分为三个层次,首先是器件级热仿真,针对器件的结构进行了热仿真,根据器件的温度冲击仿真计算出温度响应,以预测器件的热稳定性;第二层次是电路级仿真,建立链路的行为级模型,并且根据链路中各级模块的电性能评估预测整体链路的输出参数;第三层次是系统级仿真,建立系统级热-电模型,利用电热的耦合评估电热场效应对各模块性能的影响。With the improvement of chip integration,the improvement of system performance,the reduction of package size and the advancement of high-density integration technology,the problem of electrothermal coupling is becoming more and more serious.Aiming at this problem,this paper conducts related research based on the multi-physics electro-thermal co-simulation method.The research is divided into three levels,the first is the device-level thermal simulation,the thermal simulation is carried out for the structure of the device,and the temperature response is calculated according to the temperature shock simulation of the device to predict the thermal stability of the device.The second level is circuit-level simulation,which establishes a behavior-level model of the link,and predicts the output parameters of the overall link according to the electrical performance evaluation of modules at all levels in the link.The third level is system-level simulation,where a system-level thermo-electric model is established,and the influence of electro-thermal field effects on the performance of each module is evaluated by means of electro-thermal coupling.

关 键 词：多物理场 场路协同 协同仿真 

分 类 号：TN602[电子电信—电路与系统]