基于玻璃微熔技术的高压传感器开发  

Developing High-pressure Sensor Based on Glass Micro-fusion Technology

作　　者：毛亮亮 章柯豪 付忠亮 MAO Liangliang;ZHANG Kehao;FU Zhongliang(Faculty of Engineering,Lishui University,Lishui 323000,Zhejiang;Zhejiang Yili Automobile Air Conditioning Co.,Ltd.,Longquan 323700,Zhejiang)

机构地区：[1]丽水学院工学院,浙江丽水323000 [2]浙江毅力汽车空调有限公司,浙江龙泉323700

出　　处：《丽水学院学报》2022年第5期27-32,共6页Journal of Lishui University

摘　　要：为了提高SOI硅力敏原件和弹性敏感元件的黏合性,利用玻璃微熔技术将敏感电阻固定在敏感膜片上,研发出一款高压传感器。采用微机电系统MEMS工艺制备硅应变计,增强传感器各方面的性能。以高集成度的桥式压力传感器芯片NSA9260作为信号调理芯片,其具有三阶的非线性校准能力,校准精度较高。对高压传感器的主要指标进行检测实验,结果表明:在-40~120℃的温度区间内,压力测量范围可达50 MPa,控制精度在0.1%以内。To improve the adhesion of SOI silicon force sensitive element and elastic sensitive element,a high-pressure sensor technology was developed by fixing the sensitive resistance on the sensitive diaphragm called glass micro-fusion.The silicon strain gauge was prepared by MEMS process to enhance the performance of the transducer.The high integration bridge pressure sensor chip NSA9260 is used as signal conditioning,which has the third-order nonlinear calibration ability,and the calibration accuracy can reach within 0.1%.The test results show that the pressure measurement range can reach 50 MPa and the control accuracy is less than 0.1%in the temperature range of-40~120℃.

关 键 词：玻璃微熔 微机系统(MEMS) SOI硅力敏元件 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TH703[自动化与计算机技术—控制科学与工程]