三模冗余对SRAM型FPGA寄存器上电状态的影响分析  

Analysis of XTMR processing results of register power-on state based SRAM FPGA

作　　者：马小霞[1] 李园 贾露娟 郭睿[1] MA Xiaoxia;LI Yuan;JIA Lujuan;GUO Rui(Physical Institute of Lanzhou Space Technology,Lanzhou 730000,China)

机构地区：[1]兰州空间技术物理研究所,兰州730000

出　　处：《空间电子技术》2022年第5期83-87,112,共6页Space Electronic Technology

基　　金：国家自然科学基金(编号:61971209)

摘　　要：SRAM型FPGA容易受到空间辐射环境引起的单粒子翻转效应影响,造成软件在轨故障进而影响任务成败,因此在空间应用时普遍采用三模冗余技术进行设计加固来提高软件可靠性。使用Xilinx TMRTool工具实现SRAM型FPGA的三模冗余是目前流行的三模冗余实现方式,该方式无需额外编写代码,简化了设计师的工作。分析了Xilinx TMRTool对软件网表文件的改变流程和机理,对比了三模冗余处理前后FPGA寄存器的不同布局布线结果,分析了三模冗余工具对寄存器置位和复位的影响,给出了以SRAM型FPGA为核心控制器的产品设计建议。SRAM-based FPGAs in high-radiation environments will almost certainly experience radiation-induced single event upset(SEU),which can cause physical damage to Xilinx FPGAs and result in the software errors and the meaningless works.Therefore,triple modular redundancy(TMR)approach is generally used in the design’s reinforcement to improve the reliability of the software.Xilinx TMRTool implementation is one of the popular ways of TMR.No additional code is required and it simplifies the process of designing an XTMR system.In this paper,writers analysis the changes of netlist and compare the differences of Place&Route implementation with or without TMR.As a result,Xilinx TMRTool modifies the tie of Flip-Flops’SR and REV pins.Some suggestions are given for the product design based on Virtex-II FPGA family.

关 键 词：FPGA 半锁结构 TMRTool 三模冗余 寄存器 

分 类 号：V443[航空宇航科学与技术—飞行器设计] TN402[电子电信—微电子学与固体电子学]