印制电路板低温等离子体表面改性工艺  

Surface modification of printed circuit board by low-temperature plasma

作　　者：王治伟 王军[2,3] 杨涛 王慧 WANG Zhiwei;WANG Jun;YANG Tao;WANG Hui(School of Physical Science and Technology,Suzhou University of Science and Technology,Suzhou 215009,China;School of Electronic and Information Engineering,Suzhou University of Science and Technology,Suzhou 215009,China;Changchun Institute of Optical,Fine Mechanics and Physics,Chinese Academy of Science,Changchun 130033,China)

机构地区：[1]苏州科技大学物理科学与技术学院,江苏苏州215009 [2]苏州科技大学电子与信息工程学院,江苏苏州215009 [3]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电镀与涂饰》2022年第19期1398-1402,共5页Electroplating & Finishing

基　　金：“十四五”江苏省重点学科项目(2021135);江苏省研究生工作站项目(2017272);江苏省研究生科研创新项目(KYCX17_2060)。

摘　　要：针对印制电路板(PCB)表面润湿性差的问题,对比了传统化学湿法处理和低温等离子体处理对PCB进行表面改性的效果,研究了气压和放电功率对PCB等离子体处理效果的影响。结果表明,低温等离子体的处理效果远优于化学湿法处理。在放电功率500 W、气压0.4 MPa和温度25°C的条件下等离子体处理3 s后,PCB对水的接触角降至14.8°,润湿性较好。Aiming at the problem of poor surface wettability of printed circuit board(PCB), the modification of PCB by different methods including traditional wet chemical process and low-temperature plasma treatment was compared. The effects of air pressure and discharge power during plasma treatment on the modification of PCB were studied. The results showed that the modification effectiveness of low-temperature plasma was much better than that of wet chemical process.After being treated by plasma at discharge power 500 W, air pressure 0.4 MPa, and temperature of 25 °C for 3 seconds, the PCB showed good wettability with a contact angle of 14.8° to water.

关 键 词：印制电路板 低温等离子体 表面改性 水接触角 

分 类 号：TG178[金属学及工艺—金属表面处理]