环境及方法对残余粘着率测试结果的影响  

Influence of Environment and Method on Test Results of Subsequent Adhesion Strength

作　　者：刘常锋 王燕 段永新 LIU Changfeng;WANG Yan;DUAN Yongxin(Jiangxi Sibaker New Materials Co.,Ltd.,Jiujiang 332700,Jiangxi)

机构地区：[1]江西矽贝克新材料有限公司,江西九江332700

出　　处：《有机硅材料》2022年第5期71-75,共5页Silicone Material

摘　　要：采用自制离型纸、31B标准胶带、聚对苯二甲酸乙二醇酯(PET)薄膜、不锈钢板等,研究了温度、湿度、测试静置条件对31B标准胶带剥离力测试结果的影响,探索了残余粘着率测试的改良方法。结果表明:在非标准测试环境下31B标准胶带的剥离力测试结果变化区间较宽;在残余粘着率测试中,高温高湿对测试样剥离力的负面影响更显著,而低温低湿时控制样剥离力的上升幅度更大;在20~30℃时,测试环境的相对湿度对剥离力的影响比温度的影响更明显,且当相对湿度高于60%时影响更加显著。相比于测试静置阶段,贴附步骤中环境相对湿度对剥离力的影响较为明显;为消除胶带经70℃处理后对粘接性能的影响,可将同批次中一卷胶带在70℃烘箱中放置后用于控制样剥离力测试,并与同批次其它胶带卷配合使用完成残余粘着率测试;PET薄膜作基材时,剥离力数据的可靠性比不锈钢板作基材时更高。Using self-made release paper,standard tape 31B,polyethylene terephthalate(PET)film,stainless steel plate,etc.,the influence of temperature,humidity and test standing conditions on the test results of the peeling force of 31B standard tape was studied,and the improvement of subsequent adhesion strength(SAS)was explored.The results show that the peeling force of standard tape 31B varies widely in non-standard environment.In SAS test,high temperature and high humidity have a more significant negative impact on the peel force of the sample,while the controlled sample has an increase of the peel force under low temperature and low humidity.At 20-30℃,the relative humidity of the test environment has a more significant effect on the peeling force than that of the temperature,and the influence is evident when the relative humidity is higher than 60%.Compared with the standing phase,in the tape attached step,the influence of environmental relative humidity on the peeling force is more evident in SAS test.In order to eliminate the influence of the adhesive tapes on the adhesive property,a roll of tape in the same batch is placed in an oven at 70℃to test the peel force,and used with other rolls of tape in the same batch to complete SAS test.When PET film is used as substrate,the reliability of peel force data is higher than that of stainless steel plate.

关 键 词：残余粘着率 有机硅离型剂 温度 湿度 剥离力 

分 类 号：TQ264.17[化学工程—有机化工]