功率器件热界面材料研究进展  

A Review of Thermal Interface Materials for Power Devices

作　　者：王瑾玉 张永海 魏进家[1,2] WANG Jinyu;ZHANG Yonghai;WEI Jinjia(School of Chemical Engineering and Technology,Xi’an Jiaotong University,Xi’an 710049,China;State Key Laboratory of Multiphase Flow in Power Engineering,Xi’an Jiaotong University,Xi’an 710049,China)

机构地区：[1]西安交通大学化学工程与技术学院,西安710049 [2]西安交通大学动力工程多相流国家重点实验室,西安710049

出　　处：《工程热物理学报》2022年第10期2699-2710,共12页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.51976163);陕西省重点研发计划高校联合项目–重点项目(No.2021GXLH-Z-076);中国科协第四届青年人才托举工程(No.2018QNRC001)。

摘　　要：随着功率器件向微型化、集成化快速发展,其产生的功率密度随之显著增加,对散热技术也提出了更高的要求。热界面材料用于填充固体界面间的气体空隙,减小界面接触热阻,因而在功率器件热管理中发挥着重要的作用。本文综述了近年来国内外热界面材料的研究进展,包括单一基体的热界面材料、聚合物基复合热界面材料和金属基热界面材料等,讨论了各类界面材料的强化换热效果及机理。总结了热界面材料发展过程中面临的问题,并展望未来的研究方向。With the rapid development in miniaturization and integration of power devices, the power density has increased significantly and put forward higher requirements for advanced heat transfer technology. Thermal interface materials play an important role in the thermal management of power devices, which can fill the gas gaps between solid interfaces and reduce the interface contact thermal resistance. This article reviewed the research progress of thermal interface materials in recent years, including single composite thermal interface materials, polymer-based composite thermal interface materials and metal-based thermal interface materials. Besides, the mechanisms and effects of heat transfer enhancement of various thermal interface materials were discussed.Finally,the problems faced in the development of thermal interface materials were summarized, and future research directions were prospected.

关 键 词：热界面材料 导热机理 导热系数 热膨胀系数 

分 类 号：TK121[动力工程及工程热物理—工程热物理]