高体积分数SiCp/Al复合材料浸锌前处理化学镀镍层的沉积行为  

Deposition Behavior of Electroless Nickel Coating on High Volume Fraction SiCp/Al Composites Pretreated with Zinc Immersion

作　　者：冯立 杨鑫 庞健 孙浩然 程德 崔庆新 覃业深 徐俊杰 FENG Li;YANG Xin;PANG Jian;SUN Hao-ran;CHENG De;CUI Qing-xin;QIN Ye-shen;XU Jun-jie(Beijing Spacecrafts,Beijing 100094,China;Beijing XCHD Science and Technology Development Co.,Ltd.,Beijing 100090,China)

机构地区：[1]北京卫星制造厂有限公司,北京100094 [2]北京星驰恒动科技发展有限公司,北京100090

出　　处：《材料保护》2022年第10期11-16,共6页Materials Protection

摘　　要：高体积分数SiCp/Al复合材料在电子封装领域被广泛应用。以浸锌前处理工艺在高体积分数SiCp/Al复合材料表面制备化学镀镍层。采用扫描电镜及能谱(EDS)对镀层的生长行为进行研究。结果表明:基体表面化学镀镍层初始沉积优先发生在Al相表面;SiC颗粒表面镀层主要源于Al相上化学镀镍层的二维方向生长;Al相周围小尺寸SiC颗粒90 s内被镀层覆盖,而大尺寸SiC颗粒表面40 min后被镀层完全覆盖;镀层具有优异的结合强度,主要是由于Al相及小尺寸SiC颗粒区域镀层与基体的机械咬合,以及大尺寸SiC颗粒上初始沉积镀层低的内应力。High volume fraction SiCp/Al composites are widely used in the field of electronic packaging. In this paper, electroless nickel coatings were prepared on the surface of high volume fraction SiCp/Al composites pretreated with zinc immersion, and the growth behavior of the coatings was studied by scanning electron microscope(SEM) and energy dispersive spectrometer(EDS). Results showed that the initial deposition of electroless nickel coating on the substrate preferentially occurred on the surface of Al phase. The coating on SiC particles mainly originated from the two-dimensional growth of electroless nickel layer on Al phase. Moreover, the small-size SiC particles around Al phase were covered by coating in 90 s, while the large-size SiC particles were completely covered by coating after 40 min. Besides, the excellent adhesive strength of coating was mainly due to the mechanical interaction between the coating on Al phase and small-size SiC particles and the substrate, as well as the low internal stress of the initial deposited coating on large-size SiC particles.

关 键 词：高体积分数SiCp/Al 化学镀镍 沉积过程 结合强度 

分 类 号：TQ153.12[化学工程—电化学工业]