金属基印制板阻焊剂低压喷涂技术探讨  

Discussion on low pressure spray technology of solder maskformetal based PCB

作　　者：邹文辉 高瑞军 邹子誉 罗奇 Zou Wenhui;Gao Ruijuin;Zou Ziyu;Luo Qi

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517300

出　　处：《印制电路信息》2022年第10期8-12,共5页Printed Circuit Information

摘　　要：介绍印制电路板阻焊剂低压喷涂技术原理、工艺流程和金属基喷涂工艺特点,并针对金属基板低压喷涂板面散油、厚度不均、板面异物、线路拐角油墨偏薄和对位点识别困难等品质问题,提出改善方案并验证。This paper introduces the technical principle,process flow of low pressure spray,and characteristics of low pressure spray machine.It Aims at the quality problem such as scattered ink on board surface,uneven ink thickness,foreigners on board surface,and thinner ink on trace cormer,dificult identification for register mark,etc.to raise efective quality improved solution.

关 键 词：阻焊剂 感光白色油墨 金属基印制板 低压喷涂 

分 类 号：TN41[电子电信—微电子学与固体电子学]