PTFE高频电路板制造工艺探讨  

Discussion on manufacturing technology of PTFE high frequency PCB

作　　者：蓝春华 范伟名 唐心权 Lan Chunhua;Fan Weiming;Tang Xinquan

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517373 [2]广东省金属基印制板工程技术研究开发中心,广东河源517373

出　　处：《印制电路信息》2022年第10期35-38,共4页Printed Circuit Information

摘　　要：聚四氟乙烯(PTFE)材料具有良好的介电性能,化学稳定性和热稳定性,是当前5G通信用电路板的主要材料之一。其材料特性与传统的FR-4和碳氢树脂(PCH)类材料差异较大,加工制作难度高。文章以一款天线用PTFE高频双面板为研究对象,通过优化产品设计和加工参数,解决钻孔、铣板披锋、电镀前除胶和阻焊脱落等技术难点。Polytetrafluoroethylene is one of the main materials for 5G communication circuit boards due to its excellent dielectric properties,chemical and thermal stability.Compared with FR4 and Hydrocarbon Resin(PCH)materials,the properties of the materials are quite different,and is difficult to manufacture.By optimizing the design and processing parameters of a PTFE high frequency double-sides PCB used in wireless-transfers,the technical difficulties of driling,milling,desmear before electroplating and S/M peeling are solved.

关 键 词：聚四氟乙烯 钻孔 铣板 除胶 

分 类 号：TN41[电子电信—微电子学与固体电子学]