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作 者:BU Fan SONG Pengcheng LIU Yahui WANG Jun WU Xiyuan LIU Lei XU Chuanhua ZHAGN Jianfeng 卜凡;SONG Pengcheng;LIU Yahui;WANG Jun;WU Xiyuan;LIU Lei;XU Chuanhua;张建峰(College of Mechanics and Materials,Hohai University,Nanjing 21l100,China;Sinosteel Maanshan New Material Technology Co.,Ltd,Maanshan 243000,China)
机构地区:[1]College of Mechanics and Materials,Hohai University,Nanjing 21l100,China [2]Sinosteel Maanshan New Material Technology Co.,Ltd,Maanshan 243000,China
出 处:《Journal of Wuhan University of Technology(Materials Science)》2022年第5期779-786,共8页武汉理工大学学报(材料科学英文版)
摘 要:The surface of hollow glass microspheres (HGMs) was roughened by a HCl+NH_(4)F strategy,which achieved a broken ratio as 16.10%,and then metallized by electroless plating by Co nanoparticles up to 90 wt% (abbreviated as Co-HGMs).The average grain size of Co was measured to range from 0.4 to 0.5 μm.Then Co-HGMs were mixed with liquid silicone rubber and xylene,and cured on a perspex plate applicable for flexible electromagnetic shielding.By attentive parameter optimization,a film about 0.836 mm in thickness was obtained with a density of 0.729 g/cm^(3),showing a shielding effectiveness of 15.2 dB in the X-band (8.2-12.4 GHz) at room temperature,which was ascribed to the formation of a conductive network of Co-HGMs inside the film.Simultaneously,the tensile strength of 0.89 MPa at an elongation ratio of 194.5% was also obtained,showing good mechanical properties and tensile strength.
关 键 词:hollow glass microspheres(HGMs) electroless plating electromagnetic shielding film flexible film lightweight materials
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