SLM和SEBM成形纯钨组织与缺陷的对比研究  

Comparison of Microstructure and Defects Formation of Pure Tungsten Fabricated by Selective Laser and Electron Beam Melting

作　　者：陈慧 董静 资旭辉 张桃梅 韩勇[1] 陈超[1,2] Chen Hui;Dong Jing;Zi Xuhui;Zhang Taomei;Han Yong;Chen Chao(State Key Laboratory of Powder Metallurgy,Central South University,Changsha 410083,China;Shenzhen Research Institute,Central South University,Shenzhen 518057,China)

机构地区：[1]中南大学粉末冶金国家重点实验室,湖南长沙410083 [2]中南大学深圳研究院,广东深圳518057

出　　处：《稀有金属材料与工程》2022年第9期3282-3288,共7页Rare Metal Materials and Engineering

基　　金：国家重点研发计划(2017YFB0306001);国家自然科学基金(51404308)。

摘　　要：采用选区激光熔化(SLM)和选区电子束熔化(SEBM)技术成形纯钨,对比研究了2种成形方法对纯钨的宏/微观组织和力学性能的影响,利用SEM和EBSD等表征技术,分析了裂纹萌生位置及形成机制。结果表明,通过调控纯钨打印过程的工艺参数,可有效地减少SLM和SEBM成形样品内部的裂纹。SLM和SEBM打印态纯钨的致密度和硬度与输入样品的能量密度呈正比例关系。与SLM相比,SEBM成形时样品内部的温度梯度更低,热应力累积更少,成形后样品中的裂纹更少。SLM打印态样品的内部裂纹多存在于搭接区域,SLM和SEBM制备过程中产生的裂纹均具有沿晶界分布的特征,而且裂纹多萌生于大角度晶界。Pure tungsten were fabricated by selective laser melting(SLM) and selective electron beam melting(SEBM).Microstructure and mechanical properties of pure tungsten were compared under different process parameters.The crack initiation location and formation mechanism were analyzed by SEM and EBSD.The results show that the crack generation of pure tungsten printing process can be effectively reduced by adjusting the process parameters in SLM and SEBM process.The relative density and hardness of pure tungsten samples are proportional to the energy density input by SLM and SEBM.Compared with SLMed specimen,SEBMed pure tungsten has lower temperature gradient,less thermal stress accumulation and fewer cracks.There are many cracks in SLMed samples,which mostly exist in the lap areas.Cracks in SLMed and SEBMed samples are distributed along grain boundaries,most of which are initiated at high-angle grain boundaries.

关 键 词：选区激光熔化 选区电子束熔化 纯钨 微观组织 裂纹 

分 类 号：TG146.411[一般工业技术—材料科学与工程]