笔记本电脑芯片温升特性研究及产品散热性能控制系统智能设计  

Research on Temperature Rise Characteristics of Laptop Chip and Intelligent Design of Product Heat Dispersion Performance Control System

作　　者：胡海 张菁惠 孟宪春 夏利峰 叶振兴 HU Hai;ZHANG Jinghui;MENG Xianchun;XIA Lifeng;YE Zhenxing(Hefei Lianbao Information Technology Co.,Ltd.,Hefei 230601,China)

机构地区：[1]合肥联宝信息技术有限公司,安徽合肥230601

出　　处：《现代信息科技》2022年第20期159-162,共4页Modern Information Technology

摘　　要：智能制造成为实现制造产业升级的重要途径,文章通过设计笔记本电脑底层逻辑运算程序,可以实现在生产线实时检测芯片温升的响应曲线。通过实时检测温升斜率数据与阈值数据对比,可以筛选出芯片叠层结构热阻超标的产品并及时提醒检测人员。采用大数据批量检测产品热阻数据,分析产品热阻性能的稳定性,为后期产品热设计提供大数据支撑。在产品售出后,继续定期进行散热性能检测,实现笔记本电脑全生命周期的智能制造技术。Intelligent manufacturing becomes an important way for realizing the upgrading of manufacturing industry.This paper could realize the real-time detection of response curve for the rise of chip temperature in production line by designing a laptop underlying logic operation program.Through comparing the temperature rise slope data of real-time detection with the threshold data,the products with excessive thermal resistance of chip laminated structure could be screened out and inspectors will be timely reminded.The big data is adopted to test product thermal resistance data in batches and analyze the stability of product thermal resistance performance,and provide big data support for later product thermal design.After the product is sold,the heat dissipation performance test is continued regularly to realize the intelligent manufacturing technology of the whole life cycle of laptops.

关 键 词：笔记本电脑 热阻 嵌入式管理技术 热设计 智能制造 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术] TP311[自动化与计算机技术—计算机科学与技术]