柔性OLED用高耐热聚酰亚胺薄膜的制备与性能  

Preparation and Properties of High Heat-resistant Polyimide Films for Flexible OLED

作　　者：矫龙 代学民[2] 牟建新 杜志军[2] 王汉夫 董志鑫[2] 邱雪鹏 JIAO Long;DAI Xuemin;MU Jianxin;DU Zhijun;WANG Hanfu;DONG Zhixin;QIU Xuepeng(University of Science and Technology of China,Hefei 230027,China;Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China;Jida Super Engineering Plastics Engineering Research Co.Ltd.,Changchun 130012,China)

机构地区：[1]中国科学技术大学,合肥230027 [2]中国科学院长春应用化学研究所,长春130022 [3]吉大特塑工程研究有限公司,长春130012

出　　处：《高等学校化学学报》2022年第11期205-211,共7页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金(批准号:21975248)资助。

摘　　要：聚酰亚胺(PI)薄膜作为柔性有机发光显示(OLED)基板材料应用时,需要满足玻璃化转变温度(T_(g))大于450℃和热膨胀系数(CTE)在0~5×10^(-6)K^(-1)之间.为了提高PI薄膜的热性能,本文合成了2,7-占吨酮二胺(2,7-DAX),并将其与均苯四甲酸二酐(PMDA)和2-(4-氨基苯基)-5-氨基苯并噁唑(BOA)共聚制备了一系列新型PI薄膜.研究了PI薄膜的聚集态结构、耐热性能、尺寸稳定性和力学性能.结果表明,占吨酮结构和苯并噁唑结构提高了PI分子链的刚性与线性,使分子链在平面内紧密堆积与取向,制备的PI薄膜综合性能优异,玻璃化转变温度高于408℃,CTE在-5.0×10^(-6)~8.1×10^(-6)K^(-1)之间,拉伸强度大于140 MPa,拉伸模量大于4.2 GPa,断裂伸长率为7.1%~20%,5%热失重分解温度(T_(5%))在601~624℃之间.其中,PI-50和PI-60薄膜具有超高玻璃化转变温度和超低热膨胀系数,T_(g)高于450℃,CTE分别为2.1×10^(-6)K^(-1)和1.6×10^(-6)K^(-1).制备的系列PI薄膜作为柔性OLED基板材料有潜在应用前景.The glass transition temperature(T_(g))of greater than 450℃and the coefficient of thermal expansion(CTE)between 0 and 5×10^(-6)K^(-1) are required for the application of polyimide(PI)films as flexible organic lightemitting display(OLED)substrates.In order to improve the thermal properties of PI films,a series of novel PI films was prepared by the copolymerization of homemade 2,7-diaminoxanthone(2,7-DAX)with pyromellitic acid dianhydride(PMDA)and 2-(4-aminophenyl)-5-aminobenzoxazole(BOA).The aggregation structure,heat resistance,dimensional stability and mechanical properties of the films were investigated.The results show that the rigidity and linearity of PI molecular chain are improved by the structure of xanthone and benzoxazole,and the molecular chain is closely packed and oriented in the plane.The synthesized PI film has excellent comprehensive properties,with T_(g)>408℃,CTE between-5.0×10^(-6)and 8.1×10^(-6)K^(-1),tensile strength>140 MPa,tensile modulus>4.2 GPa,th elongation at break between 7.1%and 20%,and the thermogravimetric decomposition temperature(T_(5%))between601 and 624℃.Among them,PI-50 and PI-60 films have ultra-high T_(g)(>450℃)and ultra-low CTE(2.1×10^(-6)K^(-1)and 1.6×10^(-6)K^(-1)),respectively.The PI films prepared have potential application prospects as flexible OLED substrate materials.

关 键 词：占吨酮 超高玻璃化转变温度 超低热膨胀系数 柔性有机发光显示 

分 类 号：O631[理学—高分子化学]