CU低共熔离子液体中锌沉积的电化学行为研究  

Electrochemical Behavior of Zinc Electroplating Process in CU Deep Eutectic Solvents

作　　者：丁佳琪 郝建军[1] 王薪惠 赵荣兴 DING Jiaqi;HAO Jianjun;WANG Xinhui;ZHAO Rongxing(School of Environmental and Chemical Engineering,Shenyang Ligong University,Shenyang 110159,China;PetroChina Liaoning Petrochemical Branch,Panjin124000,China)

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳110159 [2]中国石油辽河石化公司,辽宁盘锦124000

出　　处：《电镀与精饰》2022年第11期24-28,共5页Plating & Finishing

摘　　要：研究了锌在氯化胆碱−尿素(CU)低共熔离子液体中的电化学行为及形核方式。使用循环伏安法和计时电流法,研究在CU低共熔离子液体中锌沉积的电化学行为及其形核理论,采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)对锌电沉积层的微观形貌和结晶取向进行观察和研究。结果表明CU低共熔离子液体的电化学窗口为2.2V。锌在CU低共熔离子液体中的电沉积过程是不可逆电极反应且形核机制为三维瞬时形核,随电流密度的改变,锌结晶的表面形貌由不规则多边形向规则的六边形转变,且会使锌晶体发生择优取向。The electrochemical behavior and nucleation mode of zinc in choline chloride-urea(CU)deep eutectic solvents were investigated.The electrochemical behavior of zinc deposition in CU deep eutectic solvents and its nucleation theory were studied using cyclic voltammetry and chronoamperometric curves,and the microscopic morphology and crystallographic orientation of zinc electrodeposited layers were observed and investigated by scanning electron microscopy(SEM)and X−ray diffractometer(XRD).The results show that the electrochemical window of CU deep eutectic solvents is 2.2 V.The electrodeposition of zinc in CU deep eutectic solvents is an irreversible electrode reaction and the nucleation mechanism is three−dimensional transient nucleation,and the surface morphology of zinc crystals changes from irregular polygons to regular hexagonal shapes with the change of current density,and the zinc crystals undergo selective orientation.

关 键 词：氯化胆碱−尿素 电沉积 循环伏安 计时电流 形核机制 

分 类 号：TQ153.1[化学工程—电化学工业]